Drive coil device
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing drive coil devices face challenges in manufacturing simplicity and cooling efficiency, particularly in oscillating armature pumps, due to the use of copper wire and sealing overmoldings that can cause displacement and untimely failure.
Innovation Solution
A drive coil device with a coil carrier and coil enclosure made of plastic, featuring a contact interface for easy installation, ventilation gaps for cooling, and a design without a sealing overmolding, using aluminum wire for cost-effectiveness and durability, along with a magnetic field bundling unit for compactness and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing overmolding is used to protect the coil, then the coil is protected against displacement and damage, but the manufacturing complexity increases and cooling efficiency decreases
Solution Approach 1:
The patent removes the sealing overmolding from the coil structure entirely. The coil is held in place by the coil holder and coil enclosure without requiring an additional sealing overmolding layer, thereby simplifying manufacturing while maintaining structural integrity through alternative fixation methods.
Solution Approach 2:
The coil enclosure is designed with ventilation gaps and holes that allow air flow through the structure. This porous design enables effective cooling of the coil while maintaining mechanical protection, eliminating the need for solid sealing overmolding that would block heat dissipation.
2Reliability
If a sealing overmolding is used to protect the coil, then the coil is protected against displacement and damage, but the cooling efficiency deteriorates
Solution Approach 1:
The coil enclosure incorporates ventilation gaps and holes throughout its structure, creating a porous design that allows continuous air flow. This enables heat to be carried away from the coil effectively, maintaining low operating temperatures without requiring a solid sealing overmolding that would trap heat.
Solution Approach 2:
The patent utilizes natural convection currents formed by the ventilation gaps to create air flow through the coil enclosure. Hot air rises and is replaced by cooler air, creating a continuous cooling cycle that efficiently removes heat from the coil without mechanical intervention.
3Use of energy by moving object
If copper wire is used for the coil, then the electrical conductivity is high, but the weight increases and cost increases
Solution Approach 1:
The patent changes the material parameter from copper to aluminum for the coil wire. Aluminum provides sufficient electrical conductivity for the application while significantly reducing both weight and material cost, achieving the required performance with optimized material selection.
4Use of energy by moving object
If copper wire is used for the coil, then the electrical conductivity is high, but the cost increases
Solution Approach 1:
The patent changes the material parameter from copper to aluminum for the coil wire. Aluminum provides sufficient electrical conductivity for the application while significantly reducing both weight and material cost, achieving the required performance with optimized material selection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables simple assembly, improved cooling, reduced weight, and enhanced durability, while maintaining high efficiency and compact design, addressing the manufacturing and cooling inefficiencies of traditional coil devices.
Implementation Method 1
the coil is configured to generate, at least in a current-operated state, a magnetic field which is configured to move the magnet body out of its rest position
Implementation Method 2
these holes and/or gaps, in particular with regard to the determination of a solid angle coverage or angle coverage of the coil by the coil enclosure... these holes and/or gaps serve for a ventilation and/or cooling of the coil
Data Source
AI summary
A drive coil device, in particular for an oscillating armature pump, includes at least one coil carrier, further includes at least one coil wire that is wound onto the coil carrier to form a coil, and at least one coil enclosure configured to at least partly enclose the coil, wherein the coil enclosure comprises at least one contact interface which is configured to receive at least an end of the coil wire.


