Drive Circuit Substrate Height Compensation for Micro LED Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for manufacturing micro LED display panels face challenges in achieving reliable electrical connections between the drive circuit substrate and the LED chips due to level differences on the substrate, which affect the binding yield and require precise alignment and high precision in conductive structure formation.
Innovation Solution
A drive circuit substrate with varying heights of driving electrodes and corresponding conductive structures is designed, where the height of the conductive structures on the second driving electrode is greater than on the first, ensuring electrical connection by aligning the LED substrate with the drive circuit substrate and applying pressure to insert the conductive structures into the LED chip electrodes, thereby improving the binding yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the drive circuit substrate has level differences on the substrate surface, then the electrical connection between drive circuit substrate and LED chips becomes unreliable, but maintaining a flat substrate surface increases manufacturing complexity and reduces adaptability to varying LED chip positions
Solution Approach 1:
The patent applies local quality by creating conductive structures with varying heights at different locations on the substrate. Specifically, the conductive structures have different first heights and second heights corresponding to different drive circuit substrate levels, allowing each local region to adapt to its specific height requirement for reliable electrical connection with LED chips.
Solution Approach 2:
The patent introduces a vertical height dimension to the conductive structures to compensate for substrate level differences. By varying the heights of conductive structures in the vertical dimension, the patent enables reliable electrical connections across different substrate levels without requiring complex lateral adjustments or repositioning mechanisms.
2Reliability
If precise alignment and high precision conductive structure formation are required to achieve reliable electrical connections, then connection reliability improves, but manufacturing complexity and production difficulty increase
Solution Approach 1:
The patent changes the height parameter of conductive structures to create a tolerance buffer for alignment. By having conductive structures with different heights (first heights and second heights), the patent allows for greater variation in horizontal positioning while maintaining reliable electrical connections, thereby reducing the stringency of manufacturing precision requirements.
Solution Approach 2:
The patent incorporates height variations in conductive structures as a preemptive measure to cushion against alignment errors. The different heights are designed in advance to accommodate potential misalignments, ensuring that even if positioning is not perfectly precise, reliable electrical connections can still be achieved.
3Reliability
If conductive structures with varying heights are used to accommodate substrate level differences, then electrical connection reliability improves, but the complexity of conductive structure formation increases
Solution Approach 1:
The patent segments the conductive structures into multiple height levels (first heights and second heights) corresponding to different substrate regions. This segmentation allows each conductive structure to be optimized for its specific location, improving electrical connection reliability while enabling modular manufacturing approaches that can simplify the overall formation process.
Data Source
AI summary
A drive circuit substrate, an LED display panel and a method of forming the same and a display device are provided, relates to the field of display technologies. The drive circuit substrate includes a base substrate and a plurality of drive electrodes arranged in an array on a surface of the base substrate. The driving electrodes include a first driving electrode and a second driving electrode, a horizontal height of the first driving electrode is greater than a horizontal height of the second driving electrode. The conductive structure includes a first conductive structure on a surface of the first driving electrode away from the base substrate and a second conductive structure on a surface of the second driving electrode away from the base substrate, a height of the second conductive structure is greater than a height of the first conductive structure.