Drive Substrate Signal Layout to Prevent ESD Line Corrosion

The patent applies dimensionality change by transitioning from a two-dimensional planar layout to a three-dimensional stacked architecture. Signal lines are divided into multiple layers (first signal line layer, second signal line layer) stacked vertically, allowing signal transmission paths to be separated in the vertical dimension while maintaining compact horizontal footprint. This resolves the contradiction by enabling compact design without signal line overlap-induced corrosion.

The patent segments the signal line system into multiple independent layers (first signal line layer and second signal line layer) with different functions. The first layer handles pixel drive signals while the second layer handles electrostatic discharge signals, separating their paths both spatially and functionally. This segmentation prevents harmful overlaps while maintaining compact overall design.

By utilizing the vertical dimension through multi-layer stacking, the patent accommodates multiple signal lines without increasing the horizontal frame area. The stacked architecture allows signal lines to be closely spaced in the vertical dimension while maintaining adequate isolation to prevent electrochemical corrosion, thus preserving compact frame area while ensuring reliability.

The patent implements nesting by placing the first signal line layer and second signal line layer within each other's vertical projection footprint. The signal lines are nested in the vertical dimension, allowing efficient space utilization in the horizontal plane while maintaining functional separation through vertical stacking and insulating layers.