Display Driver Bump Layout for Narrow-Bezel Wiring Protection
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Solution Overview
Problem
As display devices increase in size and resolution, the driver circuits face challenges in achieving high-speed operation, necessitating semiconductor elements with integrated circuits that require efficient connection and layout optimization to prevent tilting and ensure reliable electrical connections.
Innovation Solution
The display device incorporates a lead wiring that overlaps a dummy bump through a leveling film, connecting pixels to pads while using asymmetrically arranged output bumps and dummy bumps to stabilize the semiconductor element, ensuring efficient use of the frame region and preventing damage to lead wirings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the frame region is reduced to increase display area, then the display device achieves higher definition and narrower borders, but the lead wiring may come into contact with or be damaged by the semiconductor element
Solution Approach 1:
A leveling film is introduced as an intermediary layer between the lead wiring and the semiconductor element (specifically the dummy bump). This film prevents direct contact between the lead wiring and the semiconductor element, eliminating the risk of damage while allowing the frame region to be minimized for higher display area efficiency.
2Area of stationary object
If the semiconductor element is mounted with asymmetric bump arrangement, then the frame region can be narrowed and area maximized, but the element may tilt during mounting
Solution Approach 1:
The semiconductor element employs an asymmetric bump arrangement where output bumps are positioned only on one side rather than symmetrically distributed. This asymmetric configuration allows the center of gravity to be optimized, enabling the frame region to be narrowed while maintaining stable mounting without tilting.
3Productivity
If lead wiring is placed close to semiconductor element to reduce frame region, then manufacturing efficiency increases, but the risk of wiring damage during element mounting increases
Solution Approach 1:
The leveling film serves as a protective cushioning layer that is prepared in advance before the semiconductor element is mounted. This film provides mechanical protection to the lead wiring, preventing damage during the mounting process while allowing the wiring to be positioned close to the semiconductor element for manufacturing efficiency.
Data Source
AI summary
A display device includes a substrate, at least one pixel over the substrate, at least one pad over the substrate, and a lead wiring. The at least one pad is configured to be electrically connected to a semiconductor element provided over a semiconductor substrate. The lead wiring electrically connects the at least one pixel to the at least one pad. The at least one pixel includes a transistor, a leveling film over the transistor, and a display element located over the leveling film and electrically connected to the transistor. The semiconductor element includes a circuit configured to drive the at least one pixel, a bump electrically connected to the circuit, and a dummy bump electrically independent from the circuit. The lead wiring is arranged to overlap the dummy bump through the leveling film when the bump is connected to the at least one pad.