Driver Chip Package 3D Pad Layout for High Resolution Displays
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Solution Overview
Problem
The complexity of the layout of display driver chips increases with higher resolution demands, leading to a complicated display panel structure and higher manufacturing costs, with limitations in layout area, especially for small substrates, making it difficult to implement high-resolution displays effectively.
Innovation Solution
A display device configuration that includes a control circuit board generating control signals, a driver chip package with a wire film connecting the control circuit board and display panel, and a display panel with signal lines and auxiliary circuits, allowing for the formation of connection pads on both surfaces of the driver chip to increase data transmission and simplify the layout, thereby improving resolution and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the resolution of the display panel is increased, then the display quality is improved, but the layout complexity of driver chips increases and the layout area required increases
Solution Approach 1:
The patent utilizes both the upper surface and lower surface of the driver chip for pad arrangements, transitioning from a single-plane (2D) layout to a multi-plane (3D) configuration. This dimensional expansion allows additional signal lines to be routed through the lower surface, reducing layout complexity while supporting higher resolution displays.
Solution Approach 2:
The patent divides the signal transmission paths by separating them into different surfaces of the driver chip. The upper surface handles certain signal lines while the lower surface handles others, segmenting the overall layout into manageable sections that reduce complexity and improve routability for high-resolution displays.
2Measurement precision
If the resolution of the display panel is increased, then the display quality is improved, but the layout area required increases
Solution Approach 1:
By utilizing both upper and lower surfaces of the driver chip for pad placements, the patent effectively doubles the available area for signal connections without increasing the physical footprint of the chip itself. This vertical utilization of space allows higher resolution displays to be achieved within the same layout area.
3Measurement precision
If more signal lines are routed through the driver chip, then higher resolution is achieved, but the layout becomes more complicated
Solution Approach 1:
The patent resolves the routing complexity by transitioning to a three-dimensional pad arrangement that utilizes both surfaces of the driver chip. This allows additional signal lines required for high-resolution displays to be routed through the lower surface, avoiding congestion and simplifying the overall layout while accommodating more connections.
Data Source
AI summary
A display device comprises a control circuit board generating a first control signal; a driver chip package connected to the control circuit board and receiving the first control signal; and a display panel connected to the driver chip package interconnecting the control circuit board and the display panel. The display panel comprises pixels formed and signal lines connected to the pixels. The driver chip package comprises a wire film and a driver chip attached over the wire film. The driver chip is fixed to the display panel to transfer the second control signal to at least one of the plurality of signal lines. The wire film interconnects the driver chip and the control circuit board to transfer the first control signal from the control circuit board to the driver chip.