Electronic Driver Fault Diagnosis via Switch Segmentation
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Solution Overview
Problem
Existing methods for testing electronic drivers in motor vehicles fail to detect faults that occur only when the driver is soldered to a circuit board and used with a specific electrical load, as these faults are not reproducible on a test bench, leading to difficulties in identifying and isolating issues.
Innovation Solution
A method and device that utilize a microcontroller and a two-position switch to diagnose electrical faults by controlling the driver's connection to the circuit board, allowing for fault detection and location on the driver or circuit board, even when the fault is specific to a particular electrical load, and determining the nature of the fault without unsoldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the driver is tested on a test bench after unsoldering from the circuit board, then the testing process is simplified and the driver can be independently diagnosed, but faults that only occur when the driver is soldered to the circuit board with a specific electrical load cannot be detected
Solution Approach 1:
The testing method segments the fault diagnosis process into two distinct phases: first testing the driver independently on a test bench, then testing the driver while soldered to the circuit board with the specific electrical load. This segmentation allows each phase to target different types of faults, with the second phase specifically detecting faults that only manifest in the complete assembled state, thereby resolving the contradiction between ease of testing and fault detection accuracy.
Solution Approach 2:
The method performs preliminary testing on the test bench before final installation, identifying obvious faults early. Then, after soldering to the circuit board with the specific electrical load, a second diagnosis is performed to detect faults that only occur in the complete assembled state. This preliminary action followed by final verification ensures comprehensive fault detection while maintaining testing efficiency.
2Reliability
If the driver remains soldered to the circuit board for testing with the specific electrical load, then faults occurring in the complete assembly can be detected, but the testing process becomes more complex and time-consuming
Solution Approach 1:
The testing process is divided into two sequential stages: initial independent testing on a test bench, followed by final testing when soldered to the circuit board. This segmentation ensures that only necessary time is spent on each type of testing, with the second stage specifically targeting faults that only manifest in the complete assembled state, thereby minimizing total testing time while maintaining high detection accuracy.
Solution Approach 2:
Independent testing on the test bench is performed as a preliminary step to identify obvious faults before soldering. This preliminary diagnosis prevents unnecessary prolonged testing later, as clearly defective units are identified early. The final testing with the specific electrical load then focuses only on units that passed the preliminary test, optimizing the allocation of testing time.
3Ease of operation
If the driver is unsoldered from the circuit board for testing, then the driver can be tested independently, but fault location becomes difficult and production process issues cannot be identified
Solution Approach 1:
The fault location process is segmented into two levels: first, independent driver testing identifies driver-specific faults; second, testing with the driver soldered to the circuit board identifies faults in the complete assembly including solder joints and circuit board issues. This segmentation preserves the ability to perform easy independent testing while adding a second level for precise fault location in the assembled state.
Solution Approach 2:
Independent driver testing is performed as a preliminary step to identify and isolate driver-specific faults before soldering. This preliminary fault identification separates driver issues from potential circuit board or solder joint issues, making the subsequent fault location process more efficient and accurate when the driver is tested in the complete assembled state.
Data Source
AI summary
A method for testing a device for monitoring an item of equipment of a motor vehicle. The method includes controlling a driver with a microcontroller in order that the driver performs at least one diagnosis, detecting an electrical fault of the monitoring device, positioning a switch connecting the driver and the circuit board in its open position, controlling the driver with the microcontroller in order that the driver reiterates the at least one diagnosis, and, in the event of the electrical fault being detected again, locating the electrical fault on the driver or, in the event of absence of detection of the electrical fault, locating the electrical fault outside the driver and in particular on the circuit board or between the driver and the circuit board.