Driver IC Heat Transfer via Conductive Pattern Lines
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Solution Overview
Problem
As display panel sizes increase, the operating frequency and voltage of driver IC chips in display devices lead to excessive heat generation, causing overheating, malfunction, and potential damage.
Innovation Solution
A driver assembly with a heat transfer mechanism using conductive pattern lines and a heat transfer member on a substrate, along with a thermally conductive filler material, effectively transfers heat from the IC chip to a component with a lower temperature, such as a printed circuit board, while maintaining electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the operating frequency and voltage of the driver IC chip are increased to support larger display panels, then the driving capability and display size are improved, but the heat generation increases causing overheating and potential damage to the IC chip
Solution Approach 1:
The patent extracts the heat management function from the IC chip by introducing a separate heat transfer member that contacts the bottom surface of the IC chip. This heat transfer member is electrically isolated from the IC chip using an insulating layer, allowing heat to be conducted away from the chip without electrical interference. The heat is then transferred through conductive pattern lines to a heat sink, effectively removing the thermal burden from the IC chip while maintaining its high-power driving capability
Solution Approach 2:
The patent introduces multiple intermediary elements: an insulating layer that mediates between the IC chip and heat transfer member to prevent electrical contact while allowing thermal transfer, and conductive pattern lines that mediate between the heat transfer member and heat sink to transfer heat efficiently. These intermediaries enable the separation of electrical and thermal pathways, allowing the IC chip to operate at high power without overheating
2Temperature
If a heat transfer mechanism is added to remove heat from the IC chip, then the temperature control is improved, but the device complexity increases
Solution Approach 1:
The patent merges the heat transfer member and conductive pattern lines into a single integrated structure formed on the same substrate. The heat transfer member contacts the IC chip bottom surface, while conductive pattern lines extend from it to the heat sink, creating a unified thermal management system. This integration reduces the number of separate components and simplifies the overall assembly process
Solution Approach 2:
The conductive pattern lines serve dual functions: they act as thermal conduction pathways to transfer heat from the heat transfer member to the heat sink, and they are formed using the same fabrication process as the electrical wiring patterns on the substrate. This multi-functionality reduces the need for separate thermal management components and simplifies manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution efficiently removes heat from the driver IC chip, preventing overheating, malfunction, and damage, thereby enhancing the reliability of display devices.
Implementation Method 1
A heat transfer element is placed between the IC chip and the heat transfer member to transfer the heat generated by the IC chip to the heat transfer member
Implementation Method 2
A heat transfer member is formed on the substrate and is configured to transfer heat generated by the integrated circuit to a component having a lower temperature than the IC chip
Data Source
AI summary
A driver assembly with an efficient mechanism for transferring heat away from an integrated circuit (IC) chip via a heat transfer member and conductive pattern lines formed on a substrate. The IC chip is mounted on connectors and is placed above the substrate. The IC chip operatively communicates with the display panel via at least a subset of the conductive pattern lines and a subset of the connectors. A heat transfer member is formed on the substrate and is configured to transfer heat generated by the integrated circuit to a component having a lower temperature than the IC chip. A heat transfer element is placed between the IC chip and the heat transfer member to transfer the heat generated by the IC chip to the heat transfer member.