Driver IC Wiring Loop Height Noise Reduction
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Solution Overview
Problem
In ink-jet printers, the close arrangement of numerous input and output wires on a single FPC leads to signal noise interference, particularly affecting low-voltage signals like clock and data signals, due to magnetic flux from output wires, resulting in timing variations in ink jetting from nozzles.
Innovation Solution
A wiring connection structure using bonding wires with varying loop heights to connect input wires to a driver IC, where signals more susceptible to noise are transmitted through wires with higher loop heights, reducing noise interference and maintaining consistent signal timing across nozzles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a great number of output-wires and input-wires are arranged on a single FPC to increase the number of nozzles, then the productivity and resolution are improved, but the intervals between wires become small causing noise interference and signal reliability deteriorates
Solution Approach 1:
The patent divides the wiring into two separate substrates: FPC for input-wires and COF for output-wires. This segmentation physically separates the signal lines from the power lines, eliminating noise interference while maintaining support for a large number of nozzles. Each substrate handles specific wiring functions, resolving the contradiction between high nozzle count and signal quality.
Solution Approach 2:
The patent transitions from a two-dimensional arrangement of all wires on a single substrate to a three-dimensional configuration using multiple stacked substrates (FPC and COF). This dimensional change allows dense wiring connections to the driver IC without the wires interfering with each other, enabling high-resolution printing while maintaining signal integrity.
2Reliability
If bonding wires with different loop heights are used to connect input-wires to the driver IC, then the noise susceptibility of different signals is differentiated, but the device complexity increases
Solution Approach 1:
The patent applies different loop heights to bonding wires based on their specific function: higher loop heights for clock signal wires (more noise-sensitive) and lower loop heights for data signal wires. This local differentiation optimizes noise resistance for each signal type while keeping the overall structure manageable through systematic variation rather than complete complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively minimizes noise in low-voltage signals and ensures precise timing of ink jetting from nozzles, enhancing print quality by preventing signal attenuation and distortion.
Implementation Method 1
because magnetic flux is generated around the output wires due to the electric current flowing through the output wires, it is conceivable that the signal of recording data and the clock signal transmitted through the bonding wires are still likely to be affected by the magnetic flux.
Data Source
AI summary
A wiring connection structure of driver IC is provided. The wiring connection structure includes: a driver IC installed on a wiring substrate; output wires connected to output terminals of the driver IC; input wires including multiple kinds of signal input wires for transmitting multiple kinds of signals different from each other in susceptibility to an influence of noise; and bonding wires which connect input terminals of the driver IC to connection terminals of the input wires, and have an identical length to each other and a different loop height from the wiring substrate. The intervals between the input terminals are narrower than those between the connection terminals, and the loop height is higher with respect to the bonding wire connected to the connection terminal of the signal input wire for transmitting a signal more susceptible to the influence of noise.