Main Driver Impedance Calibration Using Shifted Resistance Codes

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Solution Overview

Problem

Semiconductor apparatuses face signal distortion due to external noise and impedance mismatching, which existing impedance matching techniques struggle to address effectively, especially under varying process, voltage, and temperature conditions.

Innovation Solution

A semiconductor apparatus incorporating a calibration code generating circuit, code shifting circuit, and code selecting circuits that generate and adjust calibration codes to set resistance values for a main driver based on external reference resistances, allowing for precise impedance matching and noise reduction through a shifting control signal mechanism.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a semiconductor apparatus performs impedance matching using conventional techniques, then signal transmission is improved, but signal distortion occurs due to external noise and impedance mismatching under varying PVT conditions

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoidsignal distortion
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the resistance value parameter of the termination circuit dynamically based on PVT conditions. By adjusting the termination resistance to match the impedance of the data transmission device under varying process, voltage, and temperature conditions, the system minimizes signal reflection and distortion while maintaining reliable signal transmission.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements a feedback mechanism where the controller measures the actual impedance characteristics of the data transmission device and adjusts the termination resistance accordingly. This closed-loop control ensures that the termination circuit continuously adapts to changing conditions, compensating for external noise and impedance mismatches to prevent signal distortion.

Inventive Principle:
Principle #23Feedback

2Productivity

If the operation speed of semiconductor apparatus increases and power consumption decreases, then performance is improved, but signal distortion increases due to external noise and impedance mismatching

Engineering Contradiction:
Improveoperation speedVSAvoidsignal distortion
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

As operation speed increases and power consumption decreases, the patent dynamically adjusts the termination resistance parameter to compensate for changed electrical characteristics. This ensures that even at high speeds with low power, the impedance matching remains optimal, preventing signal distortion caused by external noise and mismatching.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent makes the termination circuit dynamic by allowing real-time adjustment of resistance values based on operating conditions. This dynamic adaptation enables the system to maintain proper impedance matching across varying speeds and power levels, eliminating signal distortion that would otherwise occur in static termination circuits.

Inventive Principle:
Principle #15Dynamics

3Measurement precision

If a semiconductor apparatus uses an on-die-termination circuit for impedance matching, then signal transfer accuracy is improved, but additional circuit complexity is introduced

Engineering Contradiction:
Improvesignal transfer accuracyVSAvoidcircuit complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent merges the termination circuit directly into the semiconductor device die, integrating impedance matching functionality into the existing device structure. This integration achieves accurate signal transfer while minimizing additional complexity by sharing physical space and control resources with other device components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The on-die-termination circuit is designed to automatically adjust its resistance value without requiring external intervention or complex external circuitry. The controller within the semiconductor device self-manages the impedance matching by dynamically reconfiguring the termination resistance, thereby achieving accurate signal transfer while keeping the overall system complexity low.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS11431338B1Semiconductor apparatus performing calibration operation and a semiconductor system using the semiconductor apparatus
Publication Date: 2022.08.30 SK HYNIX INC
  • US11431338B1 patent drawing
  • US11431338B1 patent drawing
  • US11431338B1 patent drawing

AI summary

A semiconductor system includes a semiconductor apparatus and an external apparatus. The semiconductor apparatus includes a calibration code generating circuit, a code shifting circuit, and a main driver. The calibration code generating circuit performs a calibration operation to generate a calibration code. The code shifting circuit changes, based on a shifting control signal, a value of the calibration code. A resistance value of the main driver may be set on the basis of the calibration code and a shifted calibration code. The external apparatus generates the shifting control signal based on the resistance value of the main driver.