Display Panel Driver Circuit Stacking for Flexible Layout Reliability

The driver circuit is moved from a planar layout outside the display region to a three-dimensional overlapping position above the display region. This spatial reconfiguration allows the driver circuit to share the same footprint area with the display pixels, significantly improving layout flexibility and form factor freedom while maintaining manageable connection structures through vertical stacking rather than horizontal extension.

The connection structure is designed as a nested hierarchy where the terminal electrode is positioned above the pixel electrode, with intermediate connection layers and conductive films forming concentric stacked structures. This nesting approach consolidates multiple connection functions into a compact vertical arrangement, reducing the number of lateral connection points and thereby decreasing the overall likelihood of connection defects while enabling the driver circuit to overlap with the display region.

The patent employs multiple thin film layers including insulating films, conductive films, and intermediate connection layers to create a flexible stacked structure. These thin films serve as precise alignment references and isolation barriers, enabling accurate positioning of the terminal electrode relative to the pixel electrode through film thickness control and pattern alignment rather than requiring high-precision direct electrode-to-electrode alignment, thus reducing manufacturing precision requirements while maintaining connection reliability.