Driving Backplane Electrode Segmentation for Mini-LED Display
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Solution Overview
Problem
In the manufacturing of mini light-emitting diode (Mini-LED) display devices, the existing technologies face challenges in forming driving electrodes with sufficient thickness using magnetron sputtering, leading to inefficiencies and material waste due to the need for both magnetron sputtering and electroplating processes, which reduces the effective area and utilization rate of the base.
Innovation Solution
The proposed solution involves a driving backplane design with electroplating electrodes disposed within through holes in the base, connected to driving electrodes on the surface, allowing for the elimination of an electroplating region at the periphery and increasing the effective area and utilization rate of the base, while also reducing the number of wires on the surface, thereby enhancing pixel density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If magnetron sputtering is used to form driving electrodes, then the electrodes can be formed on the base surface, but the electrode thickness is insufficient and requires additional electroplating processes
Solution Approach 1:
The electrode structure is segmented into two parts: electroplating electrodes formed within through-holes penetrating the base, and driving electrodes formed on the base surface. This segmentation allows each component to perform its specialized function - the electroplating electrodes provide thickness and conductivity, while the driving electrodes provide surface-level connectivity, eliminating the need for complex multi-step electroplating processes.
Solution Approach 2:
The electrode structure transitions from a two-dimensional surface arrangement to a three-dimensional configuration by forming electroplating electrodes within through-holes that penetrate the base thickness. This vertical dimensionality change enables sufficient electrode thickness without requiring extensive lateral expansion or complex surface processing.
2Manufacturing precision
If both magnetron sputtering and electroplating processes are used, then driving electrodes with sufficient thickness can be formed, but material waste increases and manufacturing efficiency decreases
Solution Approach 1:
The harmful aspect of the conventional process - excessive material deposition and waste - is extracted and replaced by forming electroplating electrodes within confined through-holes. This extraction eliminates the need for thick material deposition on the surface, reducing material waste while achieving sufficient electrode thickness through the vertical structure.
3Area of stationary object
If electroplating electrodes are formed within through-holes in the base, then the effective area and utilization rate of the base increase, but the manufacturing process becomes more complex
Solution Approach 1:
The electroplating electrodes are nested within the through-holes of the base structure, similar to nested dolls. This nesting approach maximizes the utilization of the base volume and effective area, as the electroplating electrodes occupy the internal space of the through-holes without requiring additional lateral space, thereby increasing base utilization rate while maintaining a compact overall structure.
4Productivity
If electroplating electrodes are disposed within through-holes, then pixel density is improved, but the manufacturing process requires additional steps
Solution Approach 1:
The through-holes are formed in the base before the electroplating electrodes are deposited within them. This preliminary action of creating the through-hole structure in advance enables subsequent electroplating to proceed more efficiently, as the confining structure is already in place to guide material deposition and ensure proper electrode formation, ultimately improving pixel density while managing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces material waste, and increases the effective area of the base, leading to improved pixel density and manufacturing efficiency by eliminating the need for an electroplating region and allowing for the stacking of electroplating and driving electrodes.
Implementation Method 1
The electroplating electrodes are disposed in the sub-pixel region, and each electroplating electrode is disposed within a respective one of the first through holes
Data Source
AI summary
A driving backplane includes a base, electroplating electrodes and driving electrodes. The base has first through holes in a sub-pixel region. The electroplating electrodes are disposed in the sub-pixel region, and at least a portion of each electroplating electrode is disposed within a respective one of the first through holes. The driving electrodes are disposed in the sub-pixel region and on a first side of the base, and each driving electrode is connected to a respective one of the electroplating electrodes.