Driving Backplate Terminal Structure for Stable Mini LED Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing bonding terminals in Mini LED-based large-sized LCDs face challenges such as poor bonding contact due to accumulated conductive particles, insufficient flat contact region width, and vulnerability to oxidation and corrosion, leading to manufacturing difficulties and reduced yield.
Innovation Solution
A driving backplate with a design featuring a base substrate, insulation layer, and conductive structures where the first and second conductive layers are stacked with a flat contact region, and an opening in the insulation layer aligns with the conductive structure edges, reducing alignment complexity and enhancing the contact area, and a protective layer encapsulates the second conductive layer to prevent oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding terminals are used in Mini LED-based LCDs, then the manufacturing process is simpler, but the bonding contact quality deteriorates due to particle accumulation and insufficient flat contact region
Solution Approach 1:
The conductive structure is segmented into multiple layers (first conductive layer and second conductive layer) with distinct functions. The first conductive layer provides the base bonding surface, while the second conductive layer extends the bonding area and provides additional contact points, thereby improving bonding contact quality through functional segmentation
Solution Approach 2:
The conductive structure transitions from a two-dimensional planar configuration to a three-dimensional stacked configuration with the first and second conductive layers positioned at different heights. This dimensional change creates a flat contact region between layers, increasing the effective bonding area and improving contact quality
2Reliability
If the conductive layers have limited contact area, then the manufacturing process is easier, but the bonding reliability deteriorates due to insufficient contact area and particle accumulation
Solution Approach 1:
The first and second conductive layers are merged to form an integrated conductive structure with a flat contact region between them. This merging creates a larger effective bonding area that combines the advantages of both layers, improving bonding reliability while maintaining manufacturing feasibility through standardized layer integration
Solution Approach 2:
The insulation layer with its opening is designed to prevent particle accumulation in the bonding region. The opening acts as a particle trap or exclusion zone, converting the potential harm of particle contamination into a beneficial feature that protects the bonding interface and enhances bonding reliability
3Reliability
If the conductive layers are exposed without protection, then the structure is simpler, but the conductive layers become vulnerable to oxidation and corrosion
Solution Approach 1:
The insulation layer creates a protected environment around the conductive layers, effectively isolating them from oxygen and corrosive elements in the external environment. This insulating barrier acts as an inert atmosphere that prevents oxidation and corrosion, enhancing the reliability of the conductive structure
Solution Approach 2:
The bonding terminal structure combines multiple materials with complementary properties: conductive materials for electrical functionality, insulation materials for protection and isolation, and potentially different metal layers with varying resistance to oxidation. This composite material approach provides comprehensive protection against environmental degradation
Data Source
AI summary
The embodiment of the present disclosure provides a driving backplate including a base substrate, and an insulation layer and a plurality of conductive structures on the base substrate. The insulation layer insulates the plurality of conductive structures from each other. The plurality of conductive structures includes a first conductive layer and a second conductive layer sequentially stacked along a direction away from the base substrate. At least one portion of a region in which the first conductive layer is in contact with the second conductive layer includes a flat contact region. An opening is formed at a position in the insulation layer corresponding to the conductive structure. An edge of the opening in the insulation layer is between the first conductive layer and the second conductive layer and is correspondingly in edge regions of the first conductive layer and the second conductive layer.