Driving Chip Bump Structure with Non-Conductive Adhesive Film
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Solution Overview
Problem
The manufacturing of liquid crystal displays using anisotropic conductive films with conductive balls is complex and expensive, and the irregular distribution of these balls leads to unreliable electrical connections between the driving chip and the display panel.
Innovation Solution
A driving apparatus with bumps featuring a step-difference portion made of non-conductive elastic polymer and a fine patterned bump line, attached using a non-conductive adhesive film, which simplifies the manufacturing process and enhances the reliability of the electrical connection by eliminating the need for conductive balls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If anisotropic conductive film with conductive balls is used to attach driving chip to display panel, then electrical connection is achieved, but manufacturing complexity increases and connection reliability decreases due to irregular distribution of conductive balls
Solution Approach 1:
The patent extracts and removes the conductive balls from the adhesive film structure, replacing them with a non-conductive adhesive film combined with separate bump structures that provide electrical connection. This eliminates the irregular distribution problem of conductive balls while maintaining manufacturing simplicity.
Solution Approach 2:
The patent segments the electrical connection function from the adhesive function. The non-conductive adhesive film provides attachment, while separate bump structures with conductive materials provide electrical connection. This segmentation allows each component to be optimized independently, improving reliability without increasing overall manufacturing complexity.
2Reliability
If anisotropic conductive film with conductive balls is used, then electrical connection is established, but manufacturing cost increases
Solution Approach 1:
The patent extracts the conductive balls from the adhesive film, using a non-conductive adhesive film instead. This simplifies the material composition and reduces manufacturing costs while maintaining reliable electrical connection through the bump structures.
Solution Approach 2:
The patent changes the material parameter of the adhesive film from conductive (anisotropic conductive film with conductive balls) to non-conductive. This parameter change simplifies the manufacturing process and reduces costs while the electrical connection function is maintained through the bump structures with conductive materials.
3Ease of manufacture
If conductive balls are irregularly distributed in anisotropic conductive film, then attachment is achieved, but connection reliability deteriorates
Solution Approach 1:
The patent segments the attachment function (performed by non-conductive adhesive film) from the electrical connection function (performed by bump structures). This segmentation eliminates the need for irregularly distributed conductive balls, as the bump structures provide controlled, reliable electrical connection points while the adhesive film provides uniform attachment.
Solution Approach 2:
The patent removes the conductive balls from the adhesive film structure. The non-conductive adhesive film provides attachment without requiring any conductive elements, while separate bump structures provide the electrical connection. This extraction eliminates the irregular distribution problem entirely.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs, prevents product quality defects, and increases the reliability of the electrical connection between the driving chip and the display panel, while maintaining a robust and stable attachment.
Implementation Method 1
a step-difference portion comprising a non-conductive elastic polymer
Implementation Method 2
a non-conductive adhesive film is disposed between the display panel and the driving chip to attach the driving chip to the pad part
Data Source
AI summary
A display apparatus includes a display panel on which a pad part is formed, a driving chip including bumps making contact with the pad part, and a non-conductive adhesive film disposed between the display panel and the driving chip attaching the driving chip to the pad part. Each of the bumps includes a step-difference portion including a non-conductive elastic polymer and a bump line formed on the step-difference portion. The bump line is provided with a fine pattern through which a portion of the step-difference portion is exposed, and the bump line makes contact with the pad part. Accordingly, the reliability of the electrical connection between the driving chip and the display panel may be increased.