Driving Circuit Board Double-Sided Layout for Display Bezel Reduction
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Solution Overview
Problem
The challenge in display technology is to minimize the thickness and bezel size of liquid crystal display (LCD) and organic light-emitting diode (OLED) apparatuses while ensuring efficient image driving, as existing designs often result in a 'long chin' issue due to the limited space for driver ICs and printed circuit board assemblies (PCBAs), leading to increased thickness and bezel length.
Innovation Solution
A driving circuit board design where the driver IC is placed on one surface of a flexible printed circuit (FPC) connection board, and the PCBA is bonded to the opposite surface, allowing for a more compact layout without bending the FPC, thereby reducing the overall thickness and bezel size by optimizing the placement of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the driver IC and PCBA are placed on the same surface of the circuit connection board, then the layout is simple, but the thickness and bezel size increase due to the 'long chin' issue
Solution Approach 1:
The patent applies dimensionality change by moving the PCBA from the same surface as the driver IC to the opposite surface of the circuit connection board. This spatial reconfiguration allows both components to coexist without increasing the overall thickness or creating the 'long chin' issue, effectively utilizing the third dimension (board thickness) to resolve the layout conflict.
Solution Approach 2:
The patent segments the circuit connection board into two distinct functional surfaces: the first surface for mounting the driver IC and the second surface for bonding the PCBA. This segmentation allows independent optimization of each component's placement and reduces interference between them, thereby minimizing the bezel length while maintaining layout simplicity.
2Adaptability or versatility
If the FPC is bent to accommodate both driver IC and PCBA, then more components can be placed, but the thickness and manufacturing complexity increase
Solution Approach 1:
Instead of bending the FPC in the planar dimension, the patent utilizes the thickness dimension by placing the PCBA on the opposite surface of the circuit connection board. This eliminates the need for FPC bending while maintaining component placement flexibility, thereby simplifying manufacturing processes.
Solution Approach 2:
The patent inverts the conventional approach by placing the PCBA on the back surface rather than the front surface of the circuit connection board. This inversion eliminates the need for FPC bending and complex routing, significantly reducing manufacturing complexity while maintaining adaptability.
3Length of stationary object
If the driver IC is placed close to the display panel to reduce bezel size, then the aesthetic appeal improves, but the thermal management and signal integrity may deteriorate
Solution Approach 1:
The patent places the driver IC on the first surface of the circuit connection board close to the display panel, utilizing the proximity for compact design. The PCBA on the opposite surface provides adequate spacing for thermal management and signal routing, thus maintaining signal integrity while reducing bezel length for improved aesthetics.
Data Source
AI summary
A driving circuit board includes: a circuit connection board having a first surface and a second surface that is opposite to the first surface in a thickness direction of the circuit connection board; at least one driver integrated circuit (IC) disposed on the first surface of the circuit connection board; and a printed circuit board assembly (PCBA) bonded to the second surface of the circuit connection board.