Driving PCB Connector Grounding for Static Protection

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing driving printed circuit boards for display devices face electrical stability issues due to floating dummy ground pads that can accumulate static electricity or external charges, potentially causing damage to the liquid crystal monitor when connected to a customer system.

Innovation Solution

The solution involves an electronic device connection unit with active and dummy ground pads on a substrate, where the dummy ground pads are connected to a reference voltage and electronically coupled to active ground pads, ensuring electrical stability and preventing damage from external charges even when not connected to the customer system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If dummy ground pads are formed in the connector unit of the driving PCB, then electrical stability of signal lines is improved, but the dummy ground pads may float and accumulate static electricity causing electrical damage

Engineering Contradiction:
Improveelectrical stabilityVSAvoidstatic electricity accumulation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by pre-connecting dummy ground pads to active ground pads through conductive patterns on the PCB substrate. This connection is established before the connector is used, ensuring that dummy ground pads are always grounded and cannot accumulate static electricity, thereby preventing electrical damage while maintaining electrical stability.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses active ground pads and conductive patterns as intermediaries to connect dummy ground pads to the ground. This intermediary connection ensures that dummy ground pads are electrically stabilized without directly exposing them to external electrical shocks, thereby preventing static electricity accumulation while maintaining signal line stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If dummy ground pads are connected to active ground pads through conductive patterns, then protection from static electricity is improved, but device complexity increases

Engineering Contradiction:
Improveprotection from static electricityVSAvoidconnector unit structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges the grounding function of dummy ground pads with active ground pads by connecting them through conductive patterns on the PCB substrate. This integration allows dummy ground pads to benefit from the grounding protection of active ground pads without requiring separate grounding structures, thereby preventing static electricity accumulation while minimizing increases in device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents electrical damage to the display panel and driving circuit from external shocks by grounding the dummy ground pads, enhancing the electrical strength of the connector unit and protecting the display panel from static electricity and electrostatic discharges.

Implementation Method 1

at least a subset of the one or more dummy ground pads are electrically connected to the active ground pads

Methodology Applied
Scientific EffectElectrical Conduction: Conduction (electrical)

Data Source

PatentUS9961763B2Driving printed circuit board for display device and display device having the same
Publication Date: 2018.05.01 LG DISPLAY CO LTD
  • US9961763B2 patent drawing
  • US9961763B2 patent drawing
  • US9961763B2 patent drawing

AI summary

An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.