Driving Substrate Bending Layout for Narrow-Bezel LED Connections
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Solution Overview
Problem
The challenge in display technologies is achieving narrow bezels and reliable connections in light-emitting diode (LED) display panels, where the brittle base substrate materials make chamfering difficult, leading to edge chipping and increased stress on connection leads during the bending process, which can result in breakage and reduced reliability.
Innovation Solution
A driving substrate with a flexible film and a specific layer structure, including a wiring layer, electrode layer, and connection lead layer, is used, where the flexible film is bent to attach the connection leads to the base substrate, reducing stress and improving reliability by forming connections after bending, and using inorganic and organic layers for insulation and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flexible film is bent to attach connection leads to the base substrate, then the bezel thickness is reduced and connection reliability is improved, but stress concentration occurs at the bending region which may cause breakage
Solution Approach 1:
The patent applies beforehand cushioning by designing a bending region with specific structural features that preemptively reduce stress concentration. The bending region includes a first corner region, a second corner region, and a side region, where the connection leads are strategically positioned and configured to minimize stress accumulation before the bending process occurs. This pre-planned stress distribution prevents breakage during bending while maintaining connection reliability.
Solution Approach 2:
The patent applies local quality by creating different structural characteristics in different regions of the flexible film. The bending region has distinct properties compared to the first and second regions, with the corner regions and side region having specific geometries and material configurations tailored to their local stress conditions. This localized optimization ensures that each region performs its specific function while maintaining overall structural integrity.
2Ease of manufacture
If the connection leads are formed before bending the flexible film, then the manufacturing process is simplified, but the stress during bending causes breakage of connection leads
Solution Approach 1:
The patent applies preliminary action by pre-configuring the connection leads and bending region structure before the bending process. The connection leads are positioned and secured in the bending region with specific orientations and anchoring mechanisms that prepare them to withstand the upcoming bending stress. This preliminary preparation allows for simplified manufacturing while ensuring the connection leads survive the bending process without breakage.
3Area of stationary object
If the flexible film is bent to achieve narrow bezel, then the display area is increased, but the stress on connection leads increases causing potential breakage
Solution Approach 1:
The patent applies dimensionality change by utilizing the side region and corner regions of the flexible film to route connection leads in three-dimensional space. Instead of simple planar connections, the leads are configured to extend through multiple regions and angles, distributing stress across different spatial dimensions. This multi-dimensional routing allows the flexible film to achieve narrow bezel while protecting connection leads from concentrated stress.
Data Source
AI summary
A driving substrate includes: a base substrate including first and second surfaces and side surfaces, at least one side surface being a selected side surface; a flexible film including a first region located on the first surface, a second region located on the second surface, and a bending region located between the first and second regions, the bending region including a first corner region, a second corner region and a side region; and a wiring layer, an electrode layer and a connection lead layer disposed in sequence on a side of the flexible film away from the base substrate. The wiring layer is located in the first region, the second region and the side region. The electrode layer includes first, second, third, and fourth electrodes. Each third electrode is electrically connected to a fourth electrode through the wiring layer. The connection lead layer includes first and second connection leads.