Driving Substrate Conductive Hole Layout for Uniform Current Flow
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Solution Overview
Problem
In Micro LED display devices, the current distribution in the conductive holes of the driving substrate leads to excessive concentration and density, causing voltage drop and potential burning due to high temperature, as current is mainly concentrated in a portion of the conductive holes.
Innovation Solution
The driving substrate design includes multiple groups of conductive connection holes with intra-group and extra-group current paths, where the intra-group current path is shorter than the extra-group path, ensuring even current distribution and reducing voltage drop by dispersing current across the transmission path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple conductive holes are arranged to disperse current, then current density should be reduced, but current becomes concentrated in fewer holes due to shorter path length, increasing current density and voltage drop
Solution Approach 1:
The patent applies local quality by making the connection layer thickness non-uniform: thicker at the edges and thinner at the center of the conductive holes. This creates different electrical resistance characteristics in different regions, forcing current to distribute more evenly across all conductive holes rather than concentrating in the center holes with shorter paths. The varying thickness compensates for the path length differences, achieving uniform current distribution and reducing voltage drop.
2Reliability
If multiple conductive holes are arranged to disperse current, then current density should be reduced, but current concentration in specific holes causes excessive heat and potential burning
Solution Approach 1:
The patent applies local quality by making the connection layer thickness non-uniform: thicker at the edges and thinner at the center of the conductive holes. This creates different electrical resistance characteristics in different regions, forcing current to distribute more evenly across all conductive holes rather than concentrating in the center holes with shorter paths. The varying thickness compensates for the path length differences, achieving uniform current distribution and reducing voltage drop.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces current density and voltage drop, preventing overheating and potential burning of the connection layer by evenly distributing current, thereby enhancing the reliability and efficiency of the display device.
Implementation Method 1
A part of the connection layer extends into the first through hole to form a first conductive hole, and another part of the connection layer extends into the second through hole to form a second conductive hole to allow the electrical connection of the first wiring and second wiring through the connection layer
Data Source
AI summary
The present disclosures provide a driving substrate and a display device. The driving substrate includes a base, a first metal layer and a second metal layer, and a connection layer. The first metal layer includes a first wiring and the second metal layer includes a second wiring. A part of the connection layer extends to the first through hole to form a first conductive hole and another part extends to second through hole to from a second conductive hole. A first conductive hole and a second conductive hole form a group of conductive connection holes. The current path formed by the first conductive hole passing through the connection layer to the corresponding second conductive hole is the intra-group current path, while the current path formed by the first conductive hole passing through the connection layer to the second conductive hole in any other group is the extra-group path.