Driving Substrate Stress Buffer Layer for Large LED Displays
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Solution Overview
Problem
The challenge is to create a large-sized driving substrate for LED display panels without breaking the fragile glass substrate due to stress from thick copper layers, while maintaining high conductivity and resolution, as existing solutions require splicing small printed circuit boards which affect display quality and increase production costs.
Innovation Solution
A driving substrate with a stress buffer layer on a glass or quartz base substrate, featuring a wiring structure with multiple layers and insulating layers, where the wiring thickness exceeds a threshold, allowing for thick conductive layers without substrate damage, and includes metal layers for enhanced adhesion and protective layers to prevent oxidation, enabling large-scale production of high-resolution LED substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick copper layers are used for high conductivity wiring, then electrical conductivity is improved, but the glass substrate breaks due to stress
Solution Approach 1:
A stress buffer layer is introduced as an intermediary between the thick copper wiring layer and the glass substrate. This buffer layer absorbs and relieves the stress generated by the thick copper layer, preventing substrate breakage while allowing the copper layer to maintain its thick configuration for high conductivity
Solution Approach 2:
The patent changes the physical and mechanical parameters of the substrate system by introducing a layer with different stress characteristics. The stress buffer layer has specific mechanical properties that differ from both the copper layer and glass substrate, allowing it to absorb stress and enable the use of thicker copper layers without compromising substrate integrity
2Area of stationary object
If small printed circuit boards are spliced together to achieve large size, then substrate size is increased, but display quality deteriorates and production cost increases
Solution Approach 1:
The patent segments the substrate into a large-area glass substrate with a stress buffer layer structure, allowing the entire large area to be manufactured as a single piece rather than splicing multiple small boards. This maintains display quality while achieving the required large size
Solution Approach 2:
The patent solves the size problem by transitioning to another dimension - using a large-format glass substrate with the stress buffer layer technology, rather than horizontally splicing multiple small boards. This vertical integration approach maintains image quality while achieving large display areas
3Reliability
If thick copper layers are used to reduce wiring resistance, then electrical conductivity is improved, but substrate stress increases causing breakage
Solution Approach 1:
The stress buffer layer acts as a mediator that decouples the stress relationship between the thick copper layer and the glass substrate. It absorbs the stress from the thick copper layer, allowing high conductivity wiring without transmitting damaging stress to the substrate
Solution Approach 2:
The patent converts the harmful stress effect into a beneficial outcome by using the stress buffer layer to absorb and manage the stress. The stress that would normally cause breakage is instead contained and managed by the buffer layer, enabling the use of thick copper layers for high conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the production of large-sized driving substrates with improved resolution and display effects by relieving stress on the substrate, enabling mass production of LED substrates with enhanced adhesive forces and conductivity, thus addressing the limitations of existing technologies.
Implementation Method 1
a stress buffer layer on a glass or quartz base substrate, featuring a wiring structure with multiple layers and insulating layers, where the wiring thickness exceeds a threshold, allowing for thick conductive layers without substrate damage
Implementation Method 2
includes metal layers for enhanced adhesion and protective layers to prevent oxidation
Implementation Method 3
includes metal layers for enhanced adhesion and protective layers to prevent oxidation
Data Source
AI summary
The present disclosure provides a driving substrate, a method for preparing the same, and a flexible display device. The driving substrate includes: a base substrate; a stress buffer layer located on the base substrate; a wiring structure located on a surface of the stress buffer layer away from the base substrate, a thickness of a wiring of the wiring structure in contact with the stress buffer layer being greater than a threshold; a first insulating layer located on a surface of the wiring structure away from the base substrate; a plurality of electronic components on a surface of the first insulating layer away from the base substrate; the electronic component being connected to the wiring structure through a via hole penetrating the first insulating layer.