Driving Substrate Thermal-Conducting Pattern for Uniform Crystallization
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Solution Overview
Problem
Conventional heating processes for organic semiconductor channel layers on plastic substrates fail to achieve uniform crystallization, leading to inconsistent crystallization speeds and increased electrical anomalies in transistor devices due to inadequate heat transfer.
Innovation Solution
A driving substrate with a thermal-conducting pattern layer and a buffer layer is designed, where the thermal-conducting pattern corresponds to the locations of the channel region, gate, source, and drain, facilitating rapid and uniform heat transfer to these areas, thereby ensuring consistent device properties and reducing electrical anomalies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a platen heater is used to heat the bottom substrate for crystallization, then the organic semiconductor channel layer can be heated for crystallization, but the plastic substrate cannot uniformly transfer heat to the whole substrate within a short period of time, resulting in different heating rates and inconsistent crystallization speeds
Solution Approach 1:
The invention divides the heating function into multiple independent heating units (first heating unit, second heating unit, third heating unit) positioned at different locations (front, middle, rear) of the substrate. Each heating unit independently heats a specific region, allowing parallel heat distribution across the entire substrate area, thus achieving uniform heating without extending crystallization time.
Solution Approach 2:
The invention introduces a heat dissipation layer as an intermediary component between the heating units and the substrate. This heat dissipation layer with high thermal conductivity rapidly distributes heat from multiple heating units across the entire substrate area, enabling uniform heat transfer and eliminating the heat transfer bottleneck of conventional single-point heating.
2Reliability
If conventional single-point heating is used, then the structure is simple, but the crystallization consistency across different channel layers cannot be effectively controlled, increasing electrical anomaly chances
Solution Approach 1:
The heating system is segmented into multiple independent heating units (front, middle, rear heating units) that can be independently controlled. Each heating unit corresponds to a specific region of the substrate, allowing precise control of heating conditions for different channel layers, thereby ensuring consistent crystallization and reducing electrical anomalies.
Solution Approach 2:
The heating apparatus is designed with multi-functional heating units that can simultaneously heat multiple regions of the substrate. Each heating unit serves multiple purposes: providing localized heating, distributing heat through the heat dissipation layer, and contributing to overall uniform temperature distribution across the entire substrate area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables consistent heating uniformity across active devices, reducing the likelihood of electrical anomalies and enhancing the quality of the active devices by ensuring uniform heat distribution.
Implementation Method 1
the thermal-conducting pattern layer is disposed on the substrate and includes at least one thermal-conducting body and at least one thermal-conducting pattern connected the thermal-conducting body
Implementation Method 2
crystallization is mostly generated by heating
Data Source
AI summary
A driving substrate includes a substrate, a plurality of active devices, a thermal-conducting pattern layer and a buffer layer. The active devices are separately arranged on the substrate. Each active device includes a gate, a channel layer, a gate insulation layer, a source and a drain. The source and the drain expose a portion of the channel layer to define a channel region. The thermal-conducting pattern layer is disposed on the substrate and includes at least one thermal-conducting body and at least one thermal-conducting pattern connected to the thermal-conducting body. The thermal-conducting pattern corresponds to a location of at least one of the channel region, the channel layer, the gate, the source and the drain and each active device. The buffer layer is disposed on the substrate and covers the thermal-conducting pattern layer, and is located between the thermal-conducting pattern and each active device.