Rotating Drum Film Formation for Uniform Multilayer Thickness
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Solution Overview
Problem
Existing film formation technologies, such as those described in JP 2003-321770 A and US 2013/0092528 A1, fail to adequately address deviations from desired film thickness in multilayer films, either extending forming time or causing micro errors in layer thickness, leading to non-uniformity.
Innovation Solution
A film formation apparatus and method that adjusts the rotational speed of a rotational body supporting the substrates to ensure the number of rotations is closer to an integer, using a control mechanism to calculate and adjust the rotational speed based on desired layer thickness, forming rate, and monitoring the rotational speed to minimize deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a spin coating method is used to form a resin layer, then the resin layer can be formed quickly with good planarity, but it is difficult to control the film thickness uniformly when the resin layer has a large area
Solution Approach 1:
The patent divides the resin layer formation process into multiple segments by introducing a foraminiferous layer (a porous intermediate layer) between the substrate and the resin layer. This segmentation allows the spin coating process to form the resin layer more effectively while the foraminiferous layer provides structural support and uniformity, solving the contradiction between formation speed and thickness uniformity for large-area resin layers
2Productivity
If the resin layer area is increased to reduce the number of lithography steps, then productivity improves, but the resin layer becomes prone to deformation and manufacturing yield decreases
Solution Approach 1:
The patent introduces a foraminiferous layer as an intermediary between the substrate and the resin layer. This intermediate porous layer acts as a support structure that prevents resin layer deformation while allowing the resin layer to maintain large area coverage, thus enabling reduced lithography steps without sacrificing reliability
3Ease of manufacture
If a positive photoresist is used, then exposed portions become soluble and can be removed, but unexposed portions remain and require additional removal steps
Solution Approach 1:
The patent inverts the traditional positive photoresist approach by using a negative photoresist instead. With negative photoresist, the exposed portions become insoluble and remain as the final pattern, while unexposed portions are removed. This inversion eliminates the need for additional removal steps and reduces manufacturing time while maintaining ease of pattern formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces deviations from desired film thickness by ensuring uniformity across layers, preventing extended forming times and micro errors, thereby maintaining consistent layer thickness throughout the multilayer film.
Implementation Method 1
a first converter layer (312) including a first phosphor that converts a first charged particle beam into first light
Implementation Method 2
a resin layer and a foraminiferous layer are formed on a flat panel detector (FPD)
Data Source
Figure 1~2B
Figure 3~4
Figure 5~6
AI summary
Provided is a film formation apparatus which reduces a deviation from a desired film thickness. This film formation apparatus (1) forms a multilayer film including (n + 1) or more layers (n is a positive integer of 1 or more). The film formation apparatus (1) is provided with: a drum (10) which rotates while supporting a substrate (50); a film formation mechanism (20) which performs a film formation process on the substrate (50); and a control mechanism (40) for controlling rotation of the drum (10). The control mechanism (40) calculates the number of rotations of the drum (10) on the basis of a desired thickness of a multilayer film, an initial film formation rate setting of the film formation mechanism (20) and an initial rotational speed setting of the drum (10) and adjusts the rotational speed of the drum (10) so that the calculated number of rotations of the drum (10) approaches an integer.