Dry-Deposited Surface Finish for Damage-Free Semiconductor Layers
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Solution Overview
Problem
The complexity of computer chip manufacturing requires precise processes to minimize defects, particularly in the application of surface finishes, where existing methods like 'rock and shock' can damage the chips due to mechanical agitation.
Innovation Solution
A dry deposition method using a sputtering or chemical vapor deposition process to apply a nickel-palladium-gold surface finish directly on exposed surfaces without liquid-based plating, eliminating the need for mechanical agitation and reducing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electroless surface finishing with mechanical agitation (rock and shock) is used, then bubbles are removed and uniform surface finish is achieved, but the layer or chip can contact the sides of the basket and be damaged
Solution Approach 1:
The patent replaces the mechanical agitation system (rock and shock basket) with a chemical vapor deposition process. The surface finish is applied through vapor-phase chemical reactions without mechanical movement or agitation, eliminating the harmful mechanical contact that causes chip damage while still achieving uniform coating through controlled vapor deposition
Solution Approach 2:
The patent changes the fundamental parameters of the surface finishing process from liquid-based electroless plating requiring mechanical agitation to vapor-based chemical deposition. This parameter change allows the process to proceed without mechanical movement, achieving both uniformity through controlled vapor distribution and zero mechanical damage
2Reliability
If complex manufacturing processes are used to apply surface finish, then surface protection is improved, but manufacturing complexity and defect risk increase
Solution Approach 1:
The patent extracts and eliminates the complex liquid-based electroless plating process including basket agitation, bubble management, and multiple rinsing steps. The simplified chemical vapor deposition process achieves the same oxidation protection with fewer process steps, reducing manufacturing complexity and defect risk
Solution Approach 2:
The patent uses an inert or controlled atmosphere in the chemical vapor deposition process to prevent oxidation during coating application. This approach provides reliable surface protection while avoiding the complex liquid chemical environments and agitation mechanisms required by electroless plating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures a uniform and damage-free application of the surface finish, enhancing the integrity and lifespan of electronic components by avoiding mechanical stress during the manufacturing process.
Implementation Method 1
A dry deposition method using a sputtering or chemical vapor deposition process to apply a nickel-palladium-gold surface finish
Implementation Method 2
A dry deposition method using a sputtering or chemical vapor deposition process to apply a nickel-palladium-gold surface finish
Data Source
AI summary
An intermediary layer, such as a dry deposition layer or a surface finish, is deposited on at least one exposed surface of surfaces within a layer of a semiconductor substrate. The intermediary layer is deposited on at least an electrically conductive material within a cavity in a layer. The intermediary layer is deposited using a chemical deposition process such as physical vapor deposition, chemical vapor deposition or sputtering.