Dry Electrode Substrate Deposition for Stronger Layer Adhesion
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Solution Overview
Problem
Poor adhesion between the substrate and the compound is a challenge in the manufacturing of dry electrodes, which are considered a next-generation electrode for environmentally friendly manufacturing and cost reductions.
Innovation Solution
A dry electrode design that includes a first composite layer with an active material and a substrate layer, where the substrate layer is deposited to a thickness of 1 μm to 2 μm, and can be made of aluminum or copper, with a porosity of 30% or less, and a second composite layer with a different active material joined by rolling, enhancing adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If dry electrode manufacturing is used instead of wet electrode manufacturing, then environmental friendliness and cost are improved, but adhesion between substrate and compound deteriorates
Solution Approach 1:
The patent changes the physical and chemical parameters of the compound layer by controlling porosity (30% or less) and introducing specific chemical groups (-COOH, -OH, -NH2) to improve adhesion while maintaining dry electrode manufacturing benefits
Solution Approach 2:
The patent creates a composite structure where the compound layer is formed by combining active material particles with binder particles, where the binder provides adhesion functionality while the active material provides electrochemical function, resolving the adhesion problem in dry electrodes
2Strength
If substrate layer thickness is increased to improve adhesion, then adhesion is improved, but energy density deteriorates
Solution Approach 1:
The patent optimizes the substrate layer thickness to a specific range (1-2 μm) to achieve sufficient adhesion while minimizing the volume occupied by the substrate, thereby maintaining high energy density
3Productivity
If compound layer porosity is increased to improve electrolyte penetration, then ion transport is improved, but adhesion deteriorates
Solution Approach 1:
The patent optimizes porosity to a specific threshold (30% or less) to maintain sufficient adhesion while ensuring adequate ion transport, representing a parameter optimization to balance competing requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved adhesion between the substrate and the compound layers enhances the conductivity and maintains high energy density, reducing internal resistance and enabling efficient stacking of electrodes.
Implementation Method 1
the substrate layer may include a material deposited by at least one of physical vapor deposition (PVD), chemical vapor deposition (CVD)
Implementation Method 2
the substrate layer may include a material deposited by at least one of physical vapor deposition (PVD), chemical vapor deposition (CVD)
Implementation Method 3
the first composite layer may include voids, and some of the voids may be filled with the substrate layer
Data Source
AI summary
A dry electrode and a method of forming the dry electrode are provided. The dry electrode includes: a first composite layer including an active material; and a substrate layer on at least a first surface of the first composite layer. The method of manufacturing the dry electrode includes: dry-forming a first composite layer including an active material; and depositing a substrate layer on at least a first surface of the first composite layer.