Photosensitive Dry Film Composition for Fine Thick-Film Patterning

The patent uses a composite polymer structure combining silphenylene units (for flexibility and film properties) with fluorene units (for high resolution and crosslinking capability). This composite approach allows simultaneous achievement of good film properties and high resolution by integrating the advantages of different molecular structures in a single polymer system.

The patent modifies the chemical composition parameters of the photosensitive resin by incorporating specific functional groups (epoxy groups, carboxyl groups, hydroxyl groups) in controlled amounts. These parameter changes enhance substrate adhesion through chemical bonding while maintaining ease of processing through standard photolithography procedures.

The patent incorporates crosslinking groups and reactive sites in the polymer structure before the actual patterning process. This preliminary preparation of the molecular structure enables the thick film to maintain its shape and resist diffusion during development, allowing fine patterns to be formed even in thick film form through the pre-established molecular network.