Dry Gas Cooling and Dust Removal for Ceramic Wafer Dicing
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Solution Overview
Problem
Conventional dicing apparatuses using cutting water are unsuitable for cutting wafers with top surface layers of low processibility materials like raw ceramic, as they cannot effectively cool the cutting blade and workpiece nor remove dust efficiently without water, leading to decreased processing quality.
Innovation Solution
A cutting apparatus with a chuck table, a cutting unit having a spindle with a cutting blade, a flange unit for gas jetting, and a vacuum unit to suck dust, using gas such as air, N2, CO2, or dry mist to cool the cutting edge and remove dust without water.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cutting water is used to cool the cutting blade and workpiece, then cooling effect is improved, but dust removal capability deteriorates and processibility of low processibility materials is lowered
Solution Approach 1:
The patent uses gas (air, N2, CO2, or dry mist) instead of liquid cutting water for cooling the cutting blade and workpiece. Gas is supplied through the flange unit to the cutting region, providing cooling effect while avoiding the harmful effects of liquid water such as dust scattering and reduced processibility of ceramic materials.
Solution Approach 2:
The patent employs inert or neutral gas (such as N2, CO2, or air) to create a controlled atmosphere at the cutting zone. This inert environment prevents dust scattering, avoids chemical reactions with the workpiece material, and maintains optimal cutting conditions for low processibility materials like raw ceramic.
2Object-generated harmful factors
If cutting water is used to remove dust, then dust removal is improved, but cooling capability and processibility of certain materials deteriorate
Solution Approach 1:
The patent uses gas flow through the flange unit to simultaneously achieve dust removal and cooling. The gas is directed to the cutting region where it performs both functions: carrying away dust particles and cooling the cutting blade and workpiece, eliminating the trade-off present in water-based systems.
Solution Approach 2:
The gas supply system through the flange unit performs multiple functions simultaneously: cooling the cutting blade and workpiece, removing dust from the cutting region, and maintaining an inert atmosphere. This multi-functionality resolves the contradiction between dust removal and cooling capability.
3Ease of manufacture
If no cutting water is used, then processibility of low processibility materials is improved, but cooling and dust removal capabilities deteriorate
Solution Approach 1:
The patent employs gas (air, N2, CO2, or dry mist) supplied through the flange unit to provide cooling effect without using liquid cutting water. This maintains the processibility of low processibility materials like raw ceramic while still achieving adequate cooling of the cutting blade and workpiece.
Solution Approach 2:
The use of inert or neutral gas creates a controlled environment that preserves the surface properties of low processibility materials while providing cooling. The gas does not chemically react with or damage the material surface, maintaining processibility while delivering the necessary cooling effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise cutting of wafers with low processibility materials while maintaining processing quality by cooling the cutting blade and workpiece and effectively removing dust using a dry gas jetting and vacuum system.
Implementation Method 1
a plurality of first gas jetting passages on a periphery thereof for jetting gas radially along a cutting edge of the cutting blade
Implementation Method 2
a vacuum unit provided to the cover and configured to suck dust scattered inside the cover
Data Source
AI summary
A cutting unit of a cutting apparatus includes a fixed flange that is disposed at an end portion of a spindle to support a cutting blade and has a plurality of first gas jetting passages on a periphery thereof for jetting gas radially along a cutting edge of the cutting blade, a detachable flange that sandwiches the cutting blade in cooperation with the fixed flange and has a plurality of second gas jetting passages on a periphery thereof for jetting gas radially along the cutting edge of the cutting blade, a cover covering the cutting blade, the fixed flange, and the detachable flange, and a vacuum unit provided to the cover and configured to suck dust scattered inside the cover.