Semiconductor Drying Chamber Humidity Control to Prevent Pattern Collapse
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Solution Overview
Problem
In semiconductor manufacturing, the high aspect ratio of patterns on substrates leads to pattern collapse during drying due to capillary surface tension, and existing water-repellent agents are often deactivated by moisture in the chamber, failing to effectively prevent this collapse.
Innovation Solution
A surface treatment apparatus that includes a water-capture agent to evaporate and react with atmospheric water, preventing the deactivation of water-repellent agents and ensuring the semiconductor substrate remains water-repellent, thereby suppressing pattern collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a water-repellent agent is applied to make the semiconductor substrate water repellent, then pattern collapse is suppressed, but the water-repellent agent is deactivated by water in the chamber
Solution Approach 1:
The patent applies a water-repellent agent before the substrate is exposed to water in the chamber. By performing the water-repellent treatment in advance (before water exposure), the agent can establish its protective function on the substrate surface before water is introduced, preventing deactivation that would occur if applied after water exposure.
Solution Approach 2:
The patent introduces a water-capture agent that reacts with and removes water from the chamber atmosphere before the water-repellent agent is applied. This preliminary removal of water prevents the water-repellent agent from being deactivated by water, effectively applying a counter-action to eliminate the harmful water environment in advance.
2Productivity
If IPA is used for drying the semiconductor substrate, then the substrate is dried effectively, but watermarks are formed when water is absorbed from humid atmosphere
Solution Approach 1:
The patent creates a water-free or low-humidity atmosphere in the chamber by introducing a water-capture agent that reacts with and removes water from the atmosphere. This inert environment (deprived of water) prevents IPA from absorbing water during the drying process, thereby preventing watermark formation while maintaining efficient drying.
Solution Approach 2:
The patent introduces a water-capture agent as an intermediary substance that mediates between the humid atmosphere and the drying process. This agent reacts with water in the atmosphere, effectively removing it and creating a suitable environment for IPA drying without watermark formation.
3Adaptability or versatility
If the aspect ratio of patterns is increased, then device functionality is improved, but pattern collapse occurs due to capillary forces
Solution Approach 1:
The patent changes the surface energy parameter of the substrate by applying a water-repellent agent. This parameter change reduces the capillary forces acting on high aspect ratio patterns during drying, preventing pattern collapse while allowing the patterns to maintain their high aspect ratio for device functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains the water-repellent properties of the substrate, reducing capillary forces and preventing pattern collapse during the drying process, even in humid environments.
Implementation Method 1
a water-capture agent to evaporate and react with atmospheric water
Implementation Method 2
a water-capture agent to evaporate and react with atmospheric water
Implementation Method 3
there occurs a problem that capillary (surface tension) causes collapsing of the patterns on the semiconductor substrate in the drying process
Implementation Method 4
capillary (surface tension) causes collapsing of the patterns
Data Source
AI summary
A semiconductor manufacturing apparatus according to the present embodiment comprises a chamber. A chemical-agent supply part is configured to supply a water-repellent agent or an organic solvent to a surface of a semiconductor substrate having been cleaned with a cleaning liquid in the chamber. A spray part is configured to spray a water-capture agent capturing water into an atmosphere in the chamber.