Drying Chamber Pressure Control Using Gas and Supercritical Fluid
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Solution Overview
Problem
Current substrate processing technologies face challenges in controlling pressure within drying chambers, which can lead to substrate damage and inefficient cleaning during semiconductor manufacturing processes.
Innovation Solution
A substrate processing apparatus and method that utilize a combination of a gas supply unit and a supercritical fluid supply unit to control pressure in a drying chamber, allowing for continuous pressure increase and efficient fluid distribution, preventing substrate damage and improving cleaning efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pressure control in drying chamber is improved, then substrate damage is prevented, but device complexity increases
Solution Approach 1:
The pressure control system is segmented into two independent supply units: a gas supply unit for providing gas flow and a supercritical fluid supply unit for providing supercritical fluid. This segmentation allows each unit to be optimized for its specific function while working together to achieve precise pressure control, preventing substrate damage without requiring a single complex control system.
Solution Approach 2:
The supercritical fluid acts as an intermediary between the gas phase and liquid phase, enabling smooth pressure transitions in the drying chamber. By introducing supercritical fluid as an intermediate state, the system achieves continuous pressure control that prevents substrate damage during the drying process.
2Productivity
If cleaning efficiency is improved, then substrate quality increases, but device complexity increases
Solution Approach 1:
The fluid supply system is divided into separate gas supply and supercritical fluid supply units, each with dedicated flow control mechanisms. This segmentation enables independent optimization of cleaning parameters while maintaining system manageability, achieving high cleaning efficiency without excessive complexity.
Solution Approach 2:
The system utilizes parameter changes by transitioning from gas phase to supercritical fluid phase to enhance cleaning efficiency. By controlling pressure and temperature parameters, the system achieves superior cleaning performance while managing device complexity through parameter-based control rather than structural complexity.
3Productivity
If pressure control precision is improved, then cleaning efficiency increases, but ease of operation decreases
Solution Approach 1:
The supercritical fluid supply unit acts as an intermediary that automatically manages pressure transitions. By introducing supercritical fluid, the system achieves precise pressure control for enhanced cleaning efficiency while the automated nature of supercritical fluid introduction maintains ease of operation.
Solution Approach 2:
The pressure control system utilizes the inherent properties of supercritical fluid to self-regulate pressure in the drying chamber. The supercritical fluid automatically adjusts to maintain optimal pressure conditions for cleaning, reducing the need for complex manual control while improving cleaning efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively manages pressure within the drying chamber, preventing substrate damage and enhancing cleaning efficiency by ensuring continuous fluid flow and controlled pressure conditions.
Implementation Method 1
supplying a gas into the drying chamber to bring a pressure in the drying chamber to a first pressure
Implementation Method 2
supplying a supercritical fluid into the drying chamber after the supplying of the gas is started
Data Source
AI summary
A method of processing a substrate includes disposing a substrate in a drying chamber, and supplying a fluid into the drying chamber in which the substrate is disposed. The supplying of the fluid into the drying chamber includes supplying a gas into the drying chamber, and supplying a supercritical fluid into the drying chamber after the supplying of the gas is started.