Supercritical Drying Apparatus Flow Generator for Semiconductor Substrates
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Solution Overview
Problem
The supercritical drying process for semiconductor substrates faces inefficiencies due to low flow of drying gas in the supercritical state, leading to incomplete removal of organic solvents and increased time requirements, along with issues of particle generation and temperature loss during pressure adjustments.
Innovation Solution
A substrate treating apparatus with a controlled fluid supply and exhaust system, including a pressure adjusting member and heating element, maintains a set pressure and temperature to ensure efficient flow of drying fluid in a supercritical state, minimizing impurity generation and reducing processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pressure within the process chamber is repeatedly changed between first pressure CP1 and second pressure CP2 to generate flow of drying gas, then drying gas transfer to substrate is improved, but particles are generated in valves and transferred to process chamber, and time required for process step increases
Solution Approach 1:
A flow generator is introduced as an intermediary device between the pressure control system and the process chamber. This flow generator creates the necessary gas flow without requiring repeated valve switching, thereby preventing particle generation while maintaining effective drying gas transfer to the substrate.
Solution Approach 2:
The patent replaces the mechanical valve switching system with a flow generator that produces gas flow through a different mechanism. This substitution eliminates the particle generation issue associated with valve operation while achieving the same goal of enhancing drying gas transfer efficiency.
2Productivity
If pressure within the process chamber is repeatedly changed between first pressure CP1 and second pressure CP2 to generate flow of drying gas, then drying gas transfer to substrate is improved, but time required for process step increases
Solution Approach 1:
The flow generator enables continuous gas flow through the process chamber without the need for repeated pressurization and depressurization cycles. This continuous action maintains drying gas transfer efficiency while significantly reducing the time required for the process step.
Solution Approach 2:
The flow generator serves as a mediator that decouples the pressure control function from the flow generation function. This allows for continuous, controlled gas flow without the time-consuming repeated pressure changes, thereby improving process efficiency.
3Reliability
If drying gas in supercritical state is supplied to process chamber with sealed inside, then organic solvent removal from substrate is improved, but drying gas has little flow and cannot be appropriately transferred to substrate
Solution Approach 1:
The flow generator is introduced as an intermediary device that stimulates gas flow within the sealed process chamber. This allows the drying gas to maintain its supercritical state for effective organic solvent removal while simultaneously achieving appropriate flow speed for transfer to the substrate.
Solution Approach 2:
The flow generator creates periodic or continuous flow motion within the sealed chamber, enabling the supercritical drying gas to circulate and contact the substrate effectively. This periodic action maintains both the solvent removal efficiency and the necessary gas flow speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances drying treatment efficiency, reduces processing time, minimizes impurity generation, and compensates for temperature decreases, effectively removing solvents while maintaining process integrity.
Implementation Method 1
a heating member installed at the pressure adjusting member or a back end of the pressure adjusting member
Implementation Method 2
a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space at a set pressure
Implementation Method 3
The drying gas in the supercritical state has high dissolvability and permeability. When the drying gas in the supercritical state is supplied to the substrate, the drying gas easily permeates into the pattern on the substrate, and the organic solvent remaining on the substrate is also easily dissolved in the drying gas
Data Source
AI summary
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing an inner space; a fluid supply unit configured to supply a drying fluid to the inner space; and a fluid exhaust unit configured to exhaust the drying fluid from the inner space, and wherein the fluid exhaust unit includes an exhaust line connected to the chamber; a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space at a set pressure; and a heating member installed at the pressure adjusting member or a back end of the pressure adjusting member.