DSC Device Molding with Spacer Inserts for Heat Sink Exposure
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Solution Overview
Problem
Existing manufacturing techniques for Dual Side Cooling (DSC) electronic devices either expose the chip to the external environment, leading to potential malfunctions due to moisture and foreign bodies, or require costly lapping operations that can damage the device and increase manufacturing costs.
Innovation Solution
The use of spacer inserts to expose heat sinks during the molding process, allowing for the direct exposure of both heat sinks from the package while maintaining chip insulation and eliminating the need for lapping operations, thus reducing manufacturing costs and mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the chip is exposed on the upper surface to allow direct heat sink attachment, then heat dissipation efficiency is improved, but the chip becomes vulnerable to moisture and foreign bodies causing malfunctions
Solution Approach 1:
The patent introduces an intermediary structure (the molding compound package) that protects the chip from environmental factors while still allowing heat dissipation through the exposed heat sink. The package acts as a barrier between the chip and external contaminants, resolving the contradiction between protection and heat dissipation.
Solution Approach 2:
The patent moves the heat dissipation function to a different dimension by exposing the heat sink on the side surface rather than requiring direct chip exposure on the upper surface. This dimensional change allows the chip to remain protected while heat dissipation occurs through an alternative pathway.
2Shape
If the heat sink is fixed onto the chip prior to molding and the package is lapped to expose the heat sink, then heat sink exposure is achieved, but mechanical strain damages the electronic device and manufacturing costs increase
Solution Approach 1:
The patent performs preliminary action by designing the molding process to directly expose the heat sink during injection molding, rather than requiring subsequent lapping operations. The heat sink is positioned and secured before molding, and the mold cavity is designed to leave the heat sink exposed, eliminating the need for post-molding mechanical removal of material.
Solution Approach 2:
The patent extracts the lapping operation from the manufacturing process by designing the molding process to directly produce the desired heat sink exposure. This removes the harmful mechanical strain associated with lapping while achieving the same functional result of heat sink exposure.
3Shape
If lapping operations are performed to expose the heat sink, then heat sink exposure is achieved, but manufacturing costs increase due to additional machinery and operations
Solution Approach 1:
The patent merges the heat sink exposure function into the injection molding process itself. By designing the mold cavity and positioning the heat sink appropriately, the exposure of the heat sink is achieved as an integrated part of the molding operation, eliminating the need for separate lapping machinery and operations.
Solution Approach 2:
The patent removes the lapping operation from the manufacturing sequence by redesigning the molding process to directly achieve heat sink exposure. This extraction of the harmful operation reduces manufacturing complexity and cost while maintaining the desired functional outcome.
Data Source
AI summary
A DSC type device manufacturing process includes placing a circuit assembly in a mold. The circuit assembly includes a first heat sink, a semiconductor chip mounted on the first heat sink, a second heat sink mounted on the semiconductor chip and a pin block electrically connected to the semiconductor chip. An outer surface of the first heat sink and an outer surface of the pin block are placed in contact with a first inner surface of the mold. A spacer insert is placed in contact with, and positioned between, a second inner surface of the mold and an outer surface of the second heat sink. The mold is filled with an insulating material that is subsequently hardened. After hardening, a resulting device is extracted from the mold with the outer surfaces of the first heat sink, the pin block and the second heat sink exposed.