DSC Package Encapsulation with Cooling Plate Flash Control
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Solution Overview
Problem
Conventional encapsulation processes for Double-Sided Cooled (DSC) packages result in excessive mold flash, increased production cycle time, higher costs, and reduced yield rates due to the need for additional grinding and polishing steps, which can lead to reliability failures and thickness specification issues.
Innovation Solution
A method involving a molding process with controlled air pressures and cavity inserts to seal and pack molding compound around DSC packages, eliminating the need for post-molding grinding and polishing by ensuring the top and bottom cooling plates are not covered, thus maintaining effective heat dissipation without additional processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional over-molding process is used to encapsulate DSC packages, then complete encapsulation is achieved, but excessive mold flash occurs requiring additional grinding and polishing steps
Solution Approach 1:
The cooling plates are pre-positioned on the substrate before the molding process begins. This preliminary positioning ensures that during encapsulation, the molding compound flows around rather than over the cooling plates, preventing excess material accumulation and eliminating the need for subsequent grinding and polishing operations.
Solution Approach 2:
The cooling plates serve as intermediary elements between the substrate and the molding compound. By positioning these plates first, they act as barriers that guide the molding compound flow and define the encapsulation boundaries, thereby controlling the molding process and preventing flash formation.
2Manufacturing precision
If additional grinding and polishing steps are added to remove excess molding compound, then surface quality is improved, but production cycle time increases
Solution Approach 1:
The invention converts the potential harm of molding compound overflow into a benefit by using the cooling plates as flow guides. The molding compound is directed to flow around the cooling plates, which naturally defines the encapsulation boundaries and produces a clean surface without requiring additional removal operations.
3Manufacturing precision
If additional grinding and polishing processes are implemented, then mold flash is removed, but production costs increase
Solution Approach 1:
The cooling plates perform a dual function: they serve their primary cooling purpose and simultaneously act as molds that define the encapsulation boundaries. This self-service approach eliminates the need for separate flash removal operations, as the cooling plates themselves control the molding compound flow and prevent excess material formation.
4Manufacturing precision
If conventional encapsulation process is used, then encapsulation is achieved, but yield rates are reduced due to thickness specification issues
Solution Approach 1:
By pre-positioning the cooling plates before molding, the encapsulation thickness is controlled from the outset. The cooling plates define the boundaries and ensure uniform thickness distribution, preventing defects and ensuring all packages meet specification requirements, thereby improving yield rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances mold flash control, reduces the risk of defects, simplifies the production process, and maintains the thermal performance of DSC packages by eliminating the need for additional processing steps, thereby lowering costs and improving yield rates.
Implementation Method 1
projecting a cavity insert which is movably located in the first mold half into the cavity in order to contact and apply a sealing pressure onto the at least one cooling plate
Implementation Method 2
introducing a molding compound into the cavity at a first fill pressure; and thereafter packing the molding compound in the cavity by applying a second fill pressure which is higher than the first fill pressure
Implementation Method 3
at least one cooling plate in contact with the one or more electronic devices
Data Source
AI summary
One or more electronic devices that are mounted on a substrate, including at least one cooling plate in contact with the one or more electronic devices, are encapsulated. The substrate is clamped between a first mold half and a second mold half which define a molding cavity for molding the one or more electronic devices. A cavity insert movably located in the first mold half is projected into the cavity in order to contact and apply a sealing pressure onto the at least one cooling plate. After introducing a molding compound into the cavity at a first fill pressure, the molding compound in the cavity is packed by applying a second fill pressure which is higher than the first fill pressure. During this time, the sealing pressure is maintained at values that are higher than the first fill pressure and the second fill pressure.