DSLAM Bonding Circuit Synchronizing Cross-Card Data Fragments
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional bonding circuits in DSLAM systems cannot bundle telephone lines connected to different line cards, limiting the ability to increase data transmission rates for users by combining spare lines, as they only allow bundling of lines connected to the same line card and cannot compensate for signal delays across different line cards.
Innovation Solution
A bonding circuit with a transmit signal path that fragments data packets into fragments and distributes them via a demultiplexer to various subscriber lines, and a receive signal path that reassembles fragments via a multiplexer, with adjustable delay buffers to synchronize data transmission across different line cards, enabling the bundling of subscriber lines connected to different line cards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional bonding circuits only allow bundling of lines connected to the same line card, then device complexity is reduced, but adaptability deteriorates
Solution Approach 1:
The patent introduces an uplink card as an intermediary component between multiple line cards and the backbone network. This uplink card acts as a mediator that enables bonding circuits on different line cards to communicate and synchronize with each other, allowing lines from multiple line cards to be bundled together without requiring direct complex interconnections between all bonding circuits.
Solution Approach 2:
The uplink card serves multiple functions: it provides a common interface for multiple line cards, enables synchronization between different bonding circuits, and allows flexible configuration of line bundles across line cards. This multi-functional component eliminates the need for dedicated point-to-point connections between each pair of line cards.
2Productivity
If data transmission occurs across different line cards without delay compensation, then transmission distance is increased, but signal delay synchronization deteriorates
Solution Approach 1:
The patent implements a feedback mechanism where the uplink card monitors and measures the signal transmission delays between different line cards. Based on this feedback information, the system dynamically adjusts timing parameters and delay compensation values to synchronize data transmission across line cards, ensuring that bundled lines maintain proper timing alignment even when spanning multiple cards.
Solution Approach 2:
The delay compensation mechanism is made dynamic rather than static. The system continuously adapts delay values based on actual transmission conditions, allowing the bonding circuit to maintain synchronization despite variations in transmission distance and signal path length across different line cards.
Data Source
AI summary
In a method for bonding data fragments, data fragments are delayed in such a manner that a first transmission time for a direct transmission of data fragments between a master line card and a terminal connection via a first group of subscriber lines of a telephone line bundle corresponds to a second transmission time for an indirect transmission of data fragments between the master line card, an uplink card, and a further line card via a second group of subscriber lines of the line bundle.