Stackable Package Using Double Side Mold Internal Stacking Modules
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Solution Overview
Problem
The existing semiconductor package structures, such as package-in-package (PiP) arrangements, face challenges in achieving higher packing density due to the space requirements of dummy spacers, which limit the packing density and increase the package size, hindering the integration of more semiconductor devices within a smaller footprint.
Innovation Solution
The implementation of a double side mold (DSM) internal stacking module (ISM) system that eliminates the need for dummy spacers by using a substrate with conductive traces and molding compounds to stack semiconductor dies, allowing for direct attachment and increased packing density without the height penalty of traditional spacer-based structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If dummy spacers are used in package-in-package structures, then structural support is provided, but packing density is reduced and package size increases
Solution Approach 1:
The patent removes the dummy spacer component entirely from the package structure. The ISM is directly attached to the substrate without requiring a dummy spacer for structural support, thereby eliminating the space occupation and height penalty that dummy spacers impose on the package.
Solution Approach 2:
The patent combines the structural support function with the ISM and substrate themselves. The substrate provides the structural base, and the ISM is directly mounted on it, merging the support function into the existing structural elements rather than requiring a separate dummy spacer component.
2Reliability
If dummy spacers are used to separate semiconductor die and ISM, then structural support is maintained, but manufacturing complexity increases
Solution Approach 1:
The dummy spacer component is extracted and removed from the assembly process. This eliminates the need to manufacture, handle, and attach a separate spacer component, thereby reducing manufacturing complexity while maintaining structural integrity through direct ISM-to-substrate attachment.
Solution Approach 2:
The substrate and ISM are designed to serve multiple functions: the substrate provides both electrical interconnection and structural support, while the ISM provides both functional semiconductor operations and structural presence. This multi-functionality eliminates the need for dedicated dummy spacers that only provided structural support.
3Quantity of substance
If traditional PiP structures are used, then electrical interconnection is achieved, but space utilization is reduced
Solution Approach 1:
The dummy spacer component is removed from the PiP structure, allowing the ISM to be positioned directly on the substrate. This extraction of the unnecessary component maximizes space utilization by eliminating wasted volume and reducing the overall package footprint.
Solution Approach 2:
The patent optimizes the vertical stacking arrangement by eliminating the height penalty imposed by dummy spacers. This dimensional optimization allows for more efficient use of the vertical space available in the package, enabling better space utilization without increasing device complexity.
Data Source
AI summary
A semiconductor package comprises a substrate, a first semiconductor die mounted to the substrate, and a first double side mold (DSM) internal stackable module (ISM) bonded directly to the first semiconductor die through a first adhesive. The first DSM ISM includes a first molding compound, and a second semiconductor die disposed in the first molding compound. The semiconductor package further comprises a first electrical connection coupled between the first semiconductor die and the substrate, and a second electrical connection coupled between the first DSM ISM and the substrate.