Double-Sided Molded RF Package Cooling for High Heat Flux
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Solution Overview
Problem
High-power RF packages face thermal challenges due to concentrated heat flux and high thermal resistance, which degrade device performance and reliability, especially in densely packed modules with GaN devices.
Innovation Solution
Implement top-side and/or bottom-side cooling in double-sided molded (DSM) packages using thermally conductive materials and heat spreaders, such as SiC, Si, or Cu, with vias filled with Cu, and a continuous heat spreader on the top surface, along with bottom-side heat spreaders and mold compounds to enhance thermal pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat sinks are used alone for thermal management, then the structure is simple, but the concentrated heat flux from densely packed GaN devices cannot be effectively dissipated, leading to high thermal resistance and degraded device lifetime
Solution Approach 1:
The patent divides the thermal management system into multiple segments: top-side heat spreaders attached to individual GaN devices, bottom-side heat spreaders, and intermediate heat spreaders. This segmentation allows each component to handle localized heat flux independently, effectively managing the concentrated thermal load from densely packed devices that a single heat sink cannot dissipate
Solution Approach 2:
The patent transitions from conventional single-sided bottom cooling to a multi-dimensional thermal management architecture. Heat spreaders are positioned on both top and bottom sides of semiconductor devices, creating three-dimensional thermal pathways that enable heat dissipation in multiple directions, thereby reducing junction temperature more effectively than traditional single-dimension approaches
2Adaptability or versatility
If double-sided integration is implemented to increase functionality, then the device density and functionality improve, but thermal challenges worsen due to concentrated heat flux and limited heat dissipation capability
Solution Approach 1:
The thermal management system is segmented into multiple independent heat spreaders positioned at different locations and orientations. Top-side heat spreaders manage heat from individual devices, while bottom-side and intermediate heat spreaders provide additional thermal pathways, enabling effective heat dissipation in densely integrated double-sided configurations
Solution Approach 2:
Intermediate heat spreaders are introduced as intermediary thermal management components between the top and bottom sides of the package. These intermediates facilitate heat transfer from densely packed devices on both sides, acting as mediators that enable effective thermal management in high-density double-sided integrated structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an efficient thermal pathway for heat dissipation, significantly lowering device junction temperature and improving reliability and performance.
Implementation Method 1
the vias are filled with a thermally conductive material (e.g., Copper (Cu))
Implementation Method 2
a top-side heat spreader on the back side of the first semiconductor die
Implementation Method 3
providing an enhanced thermal pathway to the ambient environment for densely packed DSM packages
Data Source
AI summary
Systems and methods are disclosed herein to enable top-side and/or bottom-side cooling for double-sided molded (DSM) packages, thereby providing an enhanced thermal pathway to the ambient environment for densely packed DSM packages.