Integrated DSP Microphone Package for Beam Forming
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Solution Overview
Problem
Conventional MEMS microphones are limited by their device characteristics and physical constraints, which restrict acoustic characteristics and geometry, hindering the achievement of desirable beam forming and noise cancelling capabilities while maintaining a compact size.
Innovation Solution
A microphone package with an integrated digital signal processor (DSP) that includes multiple MEMS sensors, where the DSP forms part of the back cavities for these sensors, enabling improved beam forming and noise cancelling characteristics by processing data from each sensor to generate enhanced microphone patterns and signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional MEMS microphones use a single acoustic back cavity formed by the substrate and cover, then the device structure is simple, but the acoustic characteristics are limited and beam forming capability is insufficient
Solution Approach 1:
The patent divides the single acoustic back cavity into multiple separate back cavities (first back cavity and second back cavity), each associated with different MEMS sensors. This segmentation allows each cavity to be independently optimized for specific acoustic characteristics, enabling diverse beam forming patterns and improved noise cancelling capability while maintaining manageable structural complexity through systematic arrangement.
Solution Approach 2:
The patent introduces spatial dimensionality by positioning multiple MEMS sensors and their corresponding back cavities in different spatial locations and orientations within the package. This multi-dimensional arrangement of sensors and cavities enables the system to achieve complex beam forming patterns and acoustic diversity that cannot be obtained with a single conventional back cavity.
2Adaptability or versatility
If multiple MEMS sensors are integrated in separate back cavities to improve beam forming and noise cancelling, then acoustic diversity is enhanced, but the physical size of the package increases
Solution Approach 1:
The patent employs a nested arrangement where multiple back cavities are integrated within a compact package structure. The first and second back cavities are positioned adjacent to each other and share common structural elements, allowing the multiple cavities to be nested or tightly packed within the package volume, thereby achieving acoustic diversity without proportionally increasing the overall package size.
Solution Approach 2:
The patent combines multiple functional elements (multiple MEMS sensors, multiple back cavities, and signal processing components) into a single integrated package. By merging these elements in a compact arrangement with shared structural components and close spatial proximity, the system achieves enhanced acoustic diversity and beam forming capability while minimizing the increase in package volume.
3Device complexity
If the digital signal processor forms part of the back cavities, then the device complexity is reduced and integration is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The digital signal processor is designed to serve multiple functions: it processes signals from the MEMS sensors and simultaneously forms part of the back cavity structures. This multi-functionality reduces the overall device complexity by eliminating separate components, while the cavity formation is achieved through standard packaging techniques that balance integration benefits with manufacturability.
Data Source
AI summary
Systems and techniques for providing improved beam forming functionality and/or improve noise cancellation functionality in a microphone package are presented. In an implementation, a device includes a first microelectromechanical systems (MEMS) sensor, a second MEMS sensor, and a digital signal processor. The first MEMS sensor is contained in a first back cavity within the device. The second MEMS sensor is contained in a second back cavity within the device. The digital signal processor generates a cardioid microphone pattern based on data associated with the first MEMS sensor contained in the first back cavity and other data associated with the second MEMS sensor contained in the second back cavity, where the digital signal processor forms at least a portion of the first back cavity and the second back cavity.