Dual Actuator Wire Bonding Head for Precision Control

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Solution Overview

Problem

Existing bond heads face challenges in controlling motion at high speeds and maintaining structural stability, leading to inconsistent wire tail formation and positioning due to reliance on a single actuator, which increases inertia and susceptibility to temperature variations.

Innovation Solution

A bond head design utilizing two actuators, each generating independent forces that combine to control the movement of the bond head body, improving force control, reducing inertia, and enhancing structural stability, with the option to generate forces of equal or unequal magnitudes and directions to optimize movement and maintain thermal stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single actuator is used to move the bond head body, then the device complexity is reduced, but the manufacturing precision and reliability deteriorate due to increased inertia and susceptibility to temperature variations

Engineering Contradiction:
Improveactuator configurationVSAvoidwire tail formation consistency
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The single actuator is divided into two separate actuators (first actuator and second actuator), each independently controlling different aspects of the bond head body movement. This segmentation reduces the inertia of each individual actuator while distributing the control functions, thereby improving wire tail formation consistency without excessively increasing overall system complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent replaces the traditional single mechanical actuator system with a dual-actuator system that uses electromagnetic interaction (voice coil motors) for more precise and responsive control. This substitution allows for better force control and reduced mechanical inertia, improving manufacturing precision.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Device complexity

If a single actuator is used to move the bond head body, then the device complexity is reduced, but the reliability deteriorates due to susceptibility to temperature variations

Engineering Contradiction:
Improveactuator configurationVSAvoidoperational stability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

By dividing the actuation function into two separate actuators, the system distributes the thermal load and reduces the susceptibility of any single actuator to temperature variations. This segmentation improves operational stability while maintaining manageable device complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the operational parameters by using two actuators that can be independently controlled, allowing for compensation of temperature-induced variations through coordinated operation. This parameter change approach enhances reliability without significantly increasing device complexity.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If high speed actuation is implemented, then the productivity is improved, but the manufacturing precision deteriorates due to difficulty in controlling motion and maintaining structural stability

Engineering Contradiction:
Improvebonding speedVSAvoidwire tail positioning accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The dual-actuator configuration segments the high-speed actuation function, allowing each actuator to operate at optimized speeds while maintaining precise control. This enables high productivity through faster overall cycle times while preserving manufacturing precision through distributed control.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements dynamic control through two independently controllable actuators, allowing for adaptive adjustment of motion parameters during operation. This dynamic approach enables high-speed actuation while maintaining structural stability and positioning accuracy through real-time control adjustments.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This dual-actuator design enables more precise and consistent wire bonding at high speeds, improving the repeatability and linearity of wire tails while maintaining structural integrity and thermal stability.

Implementation Method 1

The actuator 114 may comprise a voice coil motor including a coil that is movable relative to a magnet by way of electromagnetic interaction when current flows through the coil

Methodology Applied
Scientific EffectElectromagnetic interaction: Lorentz Force

Implementation Method 2

the bonding tool is an ultrasonic transducer mounted onto the bond head, the ultrasonic transducer comprising a piezoelectric driver stack coupled to a horn

Methodology Applied
Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Implementation Method 3

the ultrasonic transducer comprising a piezoelectric driver stack coupled to a horn

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 4

An electronic flame-off ('EFO') device (not shown) creates an electrical spark and melts the wire to form the molten ball

Methodology Applied
Scientific EffectElectrical spark: Electric Arc

Data Source

PatentUS11289446B2Multiple actuator wire bonding apparatus
Publication Date: 2022.03.29 ASMPT SINGAPORE PTE LTD
  • US11289446B2 patent drawing
  • US11289446B2 patent drawing
  • US11289446B2 patent drawing

AI summary

According to a first aspect of the present invention, there is provided a bond apparatus for bonding a wire to a bonding surface, comprising: a bond head body movably retained by a mounting portion; a first actuator; and a second actuator, wherein the bond head body has a tool portion configured to receive a bonding tool for receiving and bonding the wire and an actuator portion coupled with the first actuator and the second actuator, the first actuator and the second actuator being operative to act on the actuator portion for moving the bond head body with respect to the mounting portion to move the bonding tool with respect to the bonding surface.