Dual Adhesive Layer Flexible Substrate Separation
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Solution Overview
Problem
Conventional flexible display manufacturing processes face challenges due to high temperature-induced separation issues between plastic and glass substrates, affecting yield and production time, as well as concerns about laser damage to circuits during separation.
Innovation Solution
A method involving a first and second adhesive layer on a loading substrate, with the adhesive force between the flexible substrate and the second layer being stronger than between the flexible substrate and the first layer, allowing for easy separation after cutting, and a similar approach with additional layers for forming a flexible flat device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If plastic substrate and glass substrate are adhered tightly, then structural stability is improved, but separation time increases and manufacturing efficiency decreases
Solution Approach 1:
The adhesive layer is segmented into two distinct layers: a first adhesive layer with strong adhesion to the glass substrate, and a second adhesive layer with weak adhesion to facilitate easy separation from the plastic substrate. This segmentation allows the adhesive system to provide both strong bonding during manufacturing and easy separation when needed, resolving the contradiction between adhesion stability and manufacturing efficiency
Solution Approach 2:
Different regions of the adhesive system have different adhesion properties: the first adhesive layer is designed with strong adhesion strength to ensure stable bonding between glass substrate and adhesive, while the second adhesive layer is designed with weak adhesion strength to enable easy separation. This local differentiation of adhesion quality allows simultaneous achievement of stable assembly and easy disassembly
2Ease of operation
If laser method is used to gasify the adhesive layer for separation, then separation capability is improved, but manufacturing time increases and circuit damage risk increases
Solution Approach 1:
The separation function is extracted from the adhesive layer itself by designing a second adhesive layer with inherently weak adhesion strength. This allows separation to occur through simple mechanical peeling without requiring external energy input such as laser heating, thereby eliminating the time loss and circuit damage risks associated with laser methods while maintaining easy separation capability
3Ease of manufacture
If high temperature is applied to form circuit on plastic substrate, then circuit formation is improved, but substrate separation increases due to thermal expansion differences
Solution Approach 1:
The adhesive system is segmented into two layers with different thermal expansion characteristics and adhesion strengths. The first adhesive layer is formulated to maintain stable bonding with the glass substrate during high-temperature circuit formation, while the second adhesive layer accommodates the plastic substrate's thermal expansion. This segmentation allows the system to withstand thermal stress without separating, enabling successful circuit formation while maintaining substrate stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method increases product yield and reduces manufacturing time by ensuring easy separation of flexible substrates while maintaining structural integrity and minimizing residual adhesive issues.
Implementation Method 1
A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer
Data Source
AI summary
A method of manufacturing a flexible substrate structure includes the following steps. A first loading substrate having a center area and a peripheral area is provided. A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein the adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer. The flexible substrate structure is cut, and the first flexible substrate is separated from the flexible substrate structure.