Dual-Airflow Cooling Layout for Electromagnetic Cooking Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electromagnetic cooking devices generate significant heat during operation, leading to reduced operational stability of electronic components due to inadequate heat dissipation.
Innovation Solution
The device incorporates a heat sink for components with high heat generation and a separate airflow channel for components with lower heat generation, utilizing dual fans to ensure effective heat dissipation through distinct airflow paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are densely packed in the electromagnetic cooking device, then device functionality is improved, but heat accumulation increases and operational stability deteriorates
Solution Approach 1:
The patent divides the heat dissipation system into two independent airflow channels: a first flow channel for high-heat components (power module, IGBT tube) and a second flow channel for low-heat components (control board, driver board). This segmentation allows each channel to be optimized independently, enabling dense component packaging while maintaining operational stability through targeted heat management.
Solution Approach 2:
The patent applies different heat dissipation strategies to different components based on their heat generation characteristics. High-heat components receive dedicated high-velocity airflow through the first channel with a first fan, while low-heat components use the second channel with a second fan. This local differentiation allows maximum component density while preserving reliability.
2Device complexity
If a single heat dissipation system is used for all electronic components, then device complexity is reduced, but heat dissipation effectiveness deteriorates
Solution Approach 1:
The heat dissipation system is segmented into two independent airflow channels with separate fans and flow paths. The first channel handles high-heat components with dedicated airflow, while the second channel handles low-heat components. This segmentation significantly improves heat dissipation effectiveness despite increased system complexity.
Solution Approach 2:
The patent introduces flow guiding structures (baffles, guide walls) as intermediaries to direct airflow precisely to different component regions. These intermediaries enable the complex dual-channel system to function efficiently by ensuring proper airflow distribution without requiring direct fan-to-component connections.
3Temperature
If high-velocity airflow is used for heat dissipation, then heat dissipation effectiveness is improved, but noise increases
Solution Approach 1:
The patent segments the airflow system into two channels with different velocity requirements. The first channel uses high-velocity airflow for high-heat components where heat dissipation effectiveness is critical, while the second channel uses lower-velocity airflow for low-heat components where noise can be reduced. This segmentation optimizes the balance between heat dissipation and noise across the entire system.
Solution Approach 2:
Different airflow velocities are applied locally to different component regions based on their heat generation characteristics. High-velocity airflow is concentrated where needed (high-heat components), while low-velocity airflow is used in other regions, achieving effective heat dissipation where required while minimizing noise in less critical areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves stable operation by efficiently dissipating heat from both high and low heat-generating components, reducing noise and maintaining device stability.
Implementation Method 1
The first electronic component is in contact with the heat sink
Implementation Method 2
the airflow generated by the first fan can take away heat of the first electronic component when flowing through the first flow channel of the heat sink
Implementation Method 3
The first fan is adapted to generate an airflow flowing through the first flow channel. The second fan is adapted to generate an airflow flowing through the second flow channel
Implementation Method 4
an electromagnetic cooking device such as an electromagnetic cooker
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The present invention discloses an electromagnetic cooking device and a combination cooker. The electromagnetic cooking device includes a circuit board, a heat sink, a coil assembly, a first fan, and a second fan. The circuit board is provided with a first electronic component and a second electronic component. The heat sink has a first flow channel. A second flow channel is defined between the coil assembly and the circuit board. The first electronic component is in contact with the heat sink, and the second electronic component is located in the second flow channel. The first fan is adapted to generate an airflow flowing through the first flow channel, and the second fan is adapted to generate an airflow flowing through the second flow channel. The airflow generated by the first fan can take away heat of the first electronic component, and the airflow generated by the second fan can take away heat of the second electronic component. Under the actions of the first fan and the second fan, there is sufficient air volume for the heat dissipation of the first electronic component and the second electronic component. Through such a configuration, accurate and effective heat dissipation of different electronic components can be achieved. As a result, the electromagnetic cooking device can operate stably.