Dual Annular Wavelength Conversion for Optoelectronic Uniformity
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Solution Overview
Problem
Current optoelectronic device packaging structures face issues with non-uniform luminescence due to surface tension causing the first layer of fluorescent glue to climb and form a concave shape, leading to uneven light distribution and potential side leakage of blue light, especially when using a double-layer dispensing process.
Innovation Solution
The implementation of an optoelectronic device with two annular structures and two wavelength conversion layers, where the first annular structure is located between the second annular structure and the substrate, preventing the first wavelength conversion layer from climbing and allowing controlled shaping to improve light output uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a double-layer dispensing process is used to form wavelength conversion layers, then the device can achieve multi-color light conversion, but the first layer of fluorescent glue climbs up the side wall due to surface tension, causing non-uniform luminescence
Solution Approach 1:
The patent divides the wavelength conversion structure into two separate annular structures (first and second annular structures) with distinct functions. The first annular structure contains the first wavelength conversion layer for primary color conversion, while the second annular structure contains the second wavelength conversion layer for secondary color conversion. This segmentation prevents the surface tension issue from affecting the entire structure uniformly and allows independent optimization of each layer's thickness and composition.
Solution Approach 2:
The patent applies different materials and configurations to different regions of the device. The first and second wavelength conversion layers use different phosphor materials with different characteristics. The annular structures have different geometries and positions, creating local variations in light interaction. This local quality approach ensures that each region contributes optimally to the overall light output uniformity.
2Ease of manufacture
If the first layer of fluorescent glue is dispensed in the annular structure, then wavelength conversion can occur, but the glue forms a curved surface with internal concavity, causing thick middle and thin edges in the second layer
Solution Approach 1:
The patent transitions from a single-layer planar structure to a multi-layer annular structure configuration. By adding the vertical dimension with stacked annular rings and introducing radial variation in the horizontal dimension, the patent creates a three-dimensional light conversion system that compensates for surface curvature effects and achieves more uniform light output across the device area.
3Device complexity
If natural or centrifugal precipitation is used in the double-layer dispensing process, then the dispensing can be simplified, but luminescence uniformity degrades and blue light side leakage occurs
Solution Approach 1:
The patent introduces the annular structures as intermediary elements between the light emitting chips and the external environment. These annular structures act as light guides and reflectors that mediate the light extraction process, directing light away from the side walls and preventing blue light leakage while maintaining uniform luminescence across the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures controllable light output and improved luminescence uniformity, enhancing the overall light output quality by preventing surface tension-induced shape irregularities and reducing side leakage.
Implementation Method 1
a first wavelength conversion layer, disposed in the first annular structure and covering the plurality of light emitting chips
Implementation Method 2
a second wavelength conversion layer, disposed in the second annular structure and covering the first wavelength conversion layer and the plurality of light emitting chips
Implementation Method 3
due to a surface tension between the annular structure and the first layer of fluorescent glue, the first layer of fluorescent glue will climb up along a side wall of the annular structure
Data Source
AI summary
An optoelectronic device and a manufacturing method thereof are provided. The optoelectronic device includes a substrate, light emitting chips disposed on the substrate and electrically connected to the substrate, a first annular structure disposed on the substrate and around the light emitting chips, a first wavelength conversion layer disposed in the first annular structure and covering the light emitting chips, a second annular structure disposed on the substrate and around the light emitting chips and further being in contact with the first annular structure, and a second wavelength conversion layer disposed in the second annular structure and covering the first wavelength conversion layer and the light emitting chips. Wavelength conversion substances contained in the first wavelength conversion layer and the second wavelength conversion layer respectively are different in material. Therefore, the optoelectronic device can achieve improved uniformity of luminescence as well as light output quality.