Dual-Arm Substrate Transport Apparatus with Independent Radial Actuation
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Solution Overview
Problem
Current robotic systems in semiconductor manufacturing lack a single robot configuration with two independent arms that can operate on a common axis of rotation with independent rotary motor actuation, capable of correcting system station errors and wafer placement without using a theta axis, while maintaining efficient substrate transfer between side-by-side substrate holding stations.
Innovation Solution
A robotic transport apparatus featuring two side-by-side independent arms with independent rotary motor actuation along a common radial axis, allowing for movement normal to the radial axis to correct system station errors and enable on-the-fly wafer placement, utilizing a common drive axis for both arms and independent drive portions for each arm to adjust spacing and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two separate transfer arms with independent radial motors are provided, then independent substrate transfer capability is achieved, but device complexity increases
Solution Approach 1:
The patent combines two transfer arms onto a single robot body with a common radial axis of rotation. Both arms share common structural elements including the robot body, radial axis, and control system, while maintaining independent actuation through separate motors. This merging approach achieves independent substrate transfer capability while reducing overall device complexity compared to completely separate transfer mechanisms.
Solution Approach 2:
The single robot body with common radial axis serves multiple functions: it supports both transfer arms, provides a unified control system, and enables coordinated operation for simultaneous substrate transfer. The common axis structure and shared components provide multi-functionality that reduces the need for separate dedicated mechanisms for each transfer arm.
2Manufacturing precision
If a theta axis is added for wafer placement correction, then placement precision is improved, but device complexity increases
Solution Approach 1:
The patent extracts the wafer placement correction function from a dedicated theta axis mechanism and integrates it into the radial arm structure. The correction capability is achieved through the radial arm's ability to adjust position and orientation within its existing degrees of freedom, eliminating the need for a separate theta axis while maintaining placement precision.
Solution Approach 2:
The radial arm structure is designed to perform multiple functions: primary substrate transfer along the radial axis and secondary wafer placement correction through positional adjustments. This multi-functionality allows the same mechanical structure to handle both transfer and precision placement without requiring additional dedicated axes.
3Ease of operation
If independent radial motors are used for each arm, then independent actuation is achieved, but device complexity increases
Solution Approach 1:
The patent merges the control architecture by implementing a unified control system that manages both transfer arms. While separate motors provide independent actuation capability, the shared control system and common radial axis coordination reduce the overall complexity compared to completely independent control systems for each arm.
Data Source
AI summary
A transfer apparatus including a frame, multiple arms connected to the frame, each arm having an end effector and an independent drive axis for extension and retraction of the respective arm with respect to other ones of the multiple arms, a linear rail defining a degree of freedom for the independent drive axis for extension and retraction of at least one arm, and a common drive axis shared by each arm and configured to pivot the multiple arms about a common pivot axis, wherein at least one of the multiple arms having another drive axis defining an independent degree of freedom with respect to other ones of the multiple arms.