Dual Arm Robots Dedicated Hot Cold Wafer End Effectors
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Solution Overview
Problem
Current semiconductor fabrication processes face challenges in increasing throughput due to the limitations in transferring wafers between different temperature states, as existing systems are not optimized for handling both hot and cold wafers efficiently, leading to suboptimal processing times and accelerations.
Innovation Solution
The implementation of dual arm robots with dedicated hot and cold wafer end effectors, made from materials with specific thermal and frictional properties, allows for optimized transfer of hot and cold wafers by using ceramics for hot wafers and perfluoroelastomers for cold wafers, enabling higher acceleration and deceleration rates without wafer slippage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single robot system is used to transfer both hot and cold wafers, then device complexity is reduced, but throughput is limited due to suboptimal transfer performance for both temperature states
Solution Approach 1:
The robot system is segmented into two dedicated arms: a hot wafer arm with ceramic end effector for hot wafer transfer, and a cold wafer arm with perfluoroelastomer end effector for cold wafer transfer. This segmentation allows each arm to be optimized for its specific temperature state, enabling higher acceleration rates and improved throughput without requiring a single compromised system
Solution Approach 2:
Different end effector materials are applied to different arms based on local requirements: ceramic material is used on the hot wafer arm for high-temperature resistance and appropriate friction characteristics, while perfluoroelastomer material is used on the cold wafer arm for optimal grip on cold wafers. This local quality differentiation enables each arm to achieve maximum performance for its specific function
2Productivity
If higher acceleration rates are used during wafer transfer, then throughput is improved, but wafer slippage occurs with conventional end effector materials
Solution Approach 1:
The friction characteristics between end effector and wafer are changed by selecting materials with optimized coefficients of friction for different temperature states. The ceramic end effector for hot wafers and perfluoroelastomer end effector for cold wafers provide enhanced frictional grip, enabling acceleration rates up to 0.5g without wafer slippage, thereby improving throughput while maintaining reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances throughput by allowing faster and more efficient transfer of wafers, improving processing efficiency by up to 10% through optimized acceleration and deceleration rates during substrate handling.
Implementation Method 1
The end effectors include perfluoroelastomers having a coefficient of friction greater than 0.4
Implementation Method 2
The implementation of dual arm robots with dedicated hot and cold wafer end effectors, made from materials with specific thermal and frictional properties
Data Source
AI summary
Methods, systems and apparatuses for high throughput substrate transfer are provided. According to various embodiments, the methods and systems described use robots having dedicated end effectors for hot and cold wafers or other substrates). Throughput is increased by optimizing the transfer of both the hot and the cold wafers. Also described are wafer transfer apparatuses having end effectors configured for supporting either hot or cold wafers. In certain embodiments, dual arm robots having dedicated hot and cold wafer arms are provided. Also provided are methods of transferring substrates that to improve overall throughput. The methods involve transferring hot and cold substrates at different accelerations.