Dual-Arm Substrate Transfer for On-the-Fly Wafer Placement

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current robotic systems in semiconductor manufacturing lack a single robot configuration with two independent arms that can operate on a common axis of rotation with independent rotary motor actuation along a radial axis, limiting their ability to correct system station errors and perform on-the-fly wafer placement without using a theta axis.

Innovation Solution

A robotic system is designed with two side-by-side independent arms, each configured to operate on a common axis of rotation with independent rotary motor actuation along a radial axis, allowing for movement normal to the radial axis to correct system station errors and facilitate on-the-fly wafer placement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If two transfer arms are provided with spacing substantially the same as the spacing between side-by-side substrate holding stations, then substrate transfer capability is achieved, but device complexity increases and independence of operation is limited

Engineering Contradiction:
Improveindependent operation capabilityVSAvoidrobot configuration
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The robot is divided into two independent arms, each capable of autonomous operation. Each arm has its own rotary motor actuation system, allowing them to function independently while sharing a common base structure. This segmentation enables each arm to service substrate holding stations independently, achieving the desired versatility without requiring a second complete robot system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The single robot body houses two arms that can both service the same set of substrate holding stations. The common axis of rotation and shared base structure provide universal functionality, while the independent actuation systems allow each arm to perform different operations simultaneously, achieving multi-functionality without proportionally increasing overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If a common axis of rotation is used for two arms, then device complexity is reduced, but the ability to correct system station errors and perform on-the-fly wafer placement is limited

Engineering Contradiction:
Improverobot structureVSAvoidwafer placement accuracy
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The arms are equipped with linear drives that enable dynamic adjustment of arm extension and retraction. This dynamic capability allows real-time correction of wafer placement positions and compensation for system station errors, maintaining high manufacturing precision despite the simplified common axis rotation structure. The linear drives provide the necessary degrees of freedom for on-the-fly adjustments.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The independent linear drive systems allow continuous adjustment of arm parameters (extension length, retraction distance) to compensate for positioning errors. By changing these parameters dynamically during operation, the system achieves high wafer placement accuracy without requiring complex mechanical structures or additional rotational axes.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If independent rotary motor actuation is provided for each arm along a radial axis, then wafer placement accuracy is improved, but device complexity increases

Engineering Contradiction:
Improvewafer placement accuracyVSAvoidactuation system
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Two rotary motor actuation systems are merged into a single robot body with a common base structure and shared control system. The motors are positioned along a common radial axis, allowing compact integration while maintaining independent operation. This merging approach achieves the required wafer placement accuracy through independent actuation without proportionally increasing overall device complexity.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of operation

If linear drives are used for extending and retracting arms, then on-the-fly wafer placement correction is enabled, but device complexity and energy consumption increase

Engineering Contradiction:
Improveon-the-fly correction capabilityVSAvoidactuation energy
Core Design Contradiction:
Ease of operationVSUse of energy by moving object

Solution Approach 1:

The linear drives are positioned and configured to enable preliminary positioning adjustments before final wafer placement. By performing coarse adjustments through linear extension/retraction and fine adjustments through rotary actuation, the system achieves on-the-fly correction capability while optimizing energy consumption by using the most efficient actuation method for each positioning stage.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11894252B2Substrate transport apparatus
Publication Date: 2024.02.06 BROOKS AUTOMATION INC
  • US11894252B2 patent drawing
  • US11894252B2 patent drawing
  • US11894252B2 patent drawing

AI summary

A transfer apparatus including a frame, multiple arms connected to the frame, each arm having an end effector and an independent drive axis for extension and retraction of the respective arm with respect to other ones of the multiple arms, a linear rail defining a degree of freedom for the independent drive axis for extension and retraction of at least one arm, and a common drive axis shared by each arm and configured to pivot the multiple arms about a common pivot axis, wherein at least one of the multiple arms having another drive axis defining an independent degree of freedom with respect to other ones of the multiple arms.