Dual-Array Multi-Spot Temperature Sensor for Liquid Storage Tanks
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Solution Overview
Problem
Conventional temperature measurement systems in liquid storage tanks face high process-downtime risks due to single or multiple spot-element failures, leading to accuracy deviations and costly replacements, where customers often have to exclude faulty elements for accurate data derivation.
Innovation Solution
Implementing a dual-array MST sensor system with a primary and redundant temperature measurement array, where the redundant array can be placed inline, above, or below the primary array, along with a smart transmitter assembly for automatic and manual redundancy selection and data processing, enabling continuous operation without downtime.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single array of temperature spot elements is used, then the device complexity is reduced, but the reliability deteriorates due to high risk of process-downtime upon failure
Solution Approach 1:
The temperature measurement system is divided into multiple independent spot elements arranged in arrays. Each spot element can be independently replaced without affecting others, enabling selective replacement of failed elements while maintaining continuous measurement capability through the remaining elements.
Solution Approach 2:
The system pre-configures multiple spot elements in arrays at the time of installation. This preliminary arrangement ensures that when a failure occurs, replacement elements are already positioned and ready for immediate substitution, minimizing process downtime and ensuring continuous operation.
2Reliability
If redundant temperature measurement arrays are implemented, then the reliability improves, but the device complexity increases
Solution Approach 1:
The system implements a copy of the temperature measurement array (redundant array) that replicates the structure and functionality of the primary array. This copy provides backup measurement capability and enables cross-validation of temperature data, ensuring measurement accuracy even when elements fail.
Solution Approach 2:
Instead of providing complete redundancy for every single spot element, the system implements redundant arrays that provide sufficient backup coverage. The redundant elements are positioned to measure temperatures at critical locations, providing excessive measurement capacity that ensures reliability while avoiding unnecessary complexity.
3Ease of repair
If complete replacement of multi-spot temperature probe is required, then the ease of repair improves, but the loss of time increases due to process-downtime
Solution Approach 1:
The temperature probe is segmented into multiple independent spot elements that can be replaced individually. This segmentation allows failed elements to be swapped out without removing the entire probe assembly, enabling repairs to be performed while the process continues uninterrupted.
Solution Approach 2:
The system is designed to facilitate self-service or minimal-intervention repairs. The modular spot element design allows operators to quickly identify and replace failed elements without requiring specialized equipment or extensive training, reducing repair time and process downtime.
Data Source
AI summary
Systems and methods for temperature measurement. In an example embodiment, two or more arrays of multi-spot temperature elements can be implemented, wherein at least one array among the two or more arrays constitutes a primary temperature measurement array and at least one other array among the two or more arrays constitutes a redundant temperature measurement array. The redundant temperature measurement array includes redundant spot temperature elements equivalent to spot temperature elements associated with the primary temperature measurement array. A transmitter assembly can also be provided, which communicates electronically with the aforementioned two or more arrays, and which processes and controls such arrays of the multi-spot temperature elements. The secondary (redundant) elements can be configured from the same material as that of the primary spot element(s) or can be composed of a different material depending on the sensor type (e.g., thermcouple, thermistor, etc.).