Dual-Backplane Structure for Server Signal Routing
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Solution Overview
Problem
Single backplanes in server or storage systems with dual control modules are inadequate for handling a large number of signal lines, leading to limited connector placement, increased circuit board layers, and cost inefficiencies, and cannot be easily expanded without lengthening the chassis, which conflicts with standard rack sizes.
Innovation Solution
A dual-backplane structure is introduced, where a first backplane connects control modules and a second backplane connects hard disk modules, with connectors on the main board slightly retracted to avoid interference and allow for wider applicability within standard rack dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single backplane is used to connect all signal lines, then the structure is simple, but the number of connectors is limited and cannot meet the interconnection requirements when there are too many signal lines
Solution Approach 1:
The patent divides the single backplane into two separate backplanes: a first backplane for connecting control modules and a second backplane for connecting hard disk modules. This segmentation allows each backplane to have dedicated connectors for specific functions, thereby increasing the overall connector capacity and meeting the interconnection requirements without excessive complexity
2Adaptability or versatility
If more connectors are placed on the main board and backplane to accommodate more signal lines, then the connector capacity increases, but the connectors interfere with each other and the hard disk connector
Solution Approach 1:
By segmenting the backplane into two separate backplanes with dedicated connector areas, the patent eliminates connector interference. The first backplane contains connectors for control modules while the second backplane contains connectors for hard disk modules, ensuring that connectors do not overlap or interfere with each other
Solution Approach 2:
The patent utilizes the vertical dimension by stacking the first and second backplanes at different heights. The first backplane is positioned above the second backplane, allowing connectors on both backplanes to be arranged in different vertical planes, thereby avoiding horizontal interference while maximizing connector capacity
3Productivity
If the number of circuit board layers is increased to increase signal fan-out area, then the signal routing capacity increases, but the circuit board cost increases
Solution Approach 1:
The patent segments the signal routing function across two separate backplanes, allowing each backplane to have optimized signal paths for its specific function. This reduces the need for excessive circuit board layers on a single backplane, as the signal fan-out is distributed across multiple boards rather than concentrated on one thick multi-layer board
Solution Approach 2:
The patent moves signal routing from a horizontal plane to a vertical stack of backplanes. By utilizing the vertical dimension and stacking backplanes, the system achieves increased signal fan-out capacity without requiring additional circuit board layers, thereby controlling manufacturing costs
4Adaptability or versatility
If cables are used to connect control modules, then the connector capacity and signal routing flexibility increase, but the chassis length must be increased to accommodate the cables
Solution Approach 1:
The patent merges the connection functions of control modules and hard disk modules onto integrated backplane structures. The first and second backplanes provide direct rigid connections through their respective connectors, eliminating the need for separate cables and reducing the overall chassis length while maintaining routing flexibility
Data Source
AI summary
The present disclosure provides a dual-backplane structure and electronic device using the same. The dual-backplane structure includes: a first backplane having an opening, and the front side of the first backplane includes at least one connector connected with a connector of the second assembly surface on a main board of a control module; a second backplane disposed on the back of the first backplane, the front side of the second backplane includes a connector connected with a connector of the first assembly surface on a main board of a control module; the back side of the second backplane includes a plurality of hard disk connectors for connecting with the hard disk module. At least one connector on the front side of the second backplane is connected with the connector corresponding to the first assembly surface on the main board through the opening of the first backplane.