Dual-Band Antenna Module for High-Frequency Signal Integrity

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

High-frequency wireless communication devices face signal attenuation and interference due to the challenges of transmitting and receiving radio frequency signals effectively at relatively high frequencies, such as 28 GHz or 60 GHz.

Innovation Solution

A semiconductor device package is designed with a substrate and dual antenna patterns of different bandwidths, where one antenna pattern generates a magnetic field, and the other is spaced apart to minimize interference, allowing for improved signal transmission and stability by using a conductive layer and dielectric layer configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If high frequency wireless transmission is used to achieve high data rate, then communication speed is improved, but signal attenuation and interference increase

Engineering Contradiction:
Improvedata rateVSAvoidsignal quality
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The antenna system is divided into multiple antenna patterns with different bandwidths operating at different frequencies. This segmentation allows the system to transmit high-frequency signals for high data rates while using lower-frequency antenna patterns to provide stable reference signals, thereby maintaining signal quality despite the challenges of high-frequency transmission.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs antenna patterns with different bandwidth parameters to operate at different frequency ranges. By changing the operating frequency parameter across multiple antenna patterns, the system achieves high data rates through higher frequencies while maintaining reliability through lower frequency patterns with broader bandwidths that provide stable communication.

Inventive Principle:
Principle #35Parameter changes

2Area of stationary object

If multiple antenna patterns are placed close together to save space, then device compactness is improved, but mutual interference between antennas increases

Engineering Contradiction:
Improvepackage areaVSAvoidantenna interference
Core Design Contradiction:
Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

Different regions of the substrate are assigned antenna patterns with different local characteristics - specifically, antenna patterns with different bandwidths and frequency ranges are placed in different locations. This local differentiation allows compact arrangement while minimizing interference, as each antenna operates in its optimized frequency range and spatial position.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent resolves spatial interference by introducing frequency dimensionality - antenna patterns are arranged not only in physical space but also across different frequency bands. This multi-dimensional arrangement allows compact packaging while maintaining signal integrity, as interference is minimized through frequency separation in addition to spatial separation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The dual-band antenna module enhances the bandwidth and stability of signal transmission, reducing interference and improving the performance of high-frequency wireless communication devices.

Implementation Method 1

The first antenna pattern has a first port configured to generate a magnetic field

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS11108131B2Semiconductor device package and method of manufacturing the same
Publication Date: 2021.08.31 ADVANCED SEMICON ENG INC
  • US11108131B2 patent drawing
  • US11108131B2 patent drawing
  • US11108131B2 patent drawing

AI summary

A semiconductor device package includes a substrate, a first antenna and a second antenna. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The first antenna pattern has a first port configured to generate a magnetic field. The second antenna pattern is disposed over the first surface of the substrate. The second antenna pattern has a second bandwidth different from the first bandwidth. A prolonged line of an edge of the first antenna pattern parallel to the magnetic field generated by the first port of the first antenna pattern is spaced apart from the second antenna pattern.