Dual-Band Array Antenna Layout for Wide-Angle Gain Stability
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Solution Overview
Problem
The maximum gain of array antennas drops significantly at maximum scan angles due to low array element count, leading to high operating temperatures and reduced efficiency from concentrated heat dissipation, necessitating increased input power.
Innovation Solution
An array antenna design with multiple rows of array elements, orthogonal feeders and slits, and dual-polarization capabilities, supporting 28 GHz and 39 GHz frequency bands, and utilizing coupling feeding to enhance gain and reduce heat concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the number of array elements is increased to maintain gain at maximum scan angle, then the antenna gain is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The antenna array is divided into multiple independent sub-arrays, each with its own feeding network. This segmentation allows each sub-array to be optimized independently while collectively achieving the desired gain performance at maximum scan angles without requiring an excessive total number of elements.
Solution Approach 2:
The patent transitions from a traditional single-plane array configuration to a multi-layer three-dimensional array structure. By distributing array elements across multiple dielectric layers and utilizing vertical spacing, the effective aperture is increased without proportionally increasing the number of elements, thereby maintaining gain at wide scan angles.
2Productivity
If the input power of each array element is increased to meet communication requirements, then the communication system capacity is improved, but the heat dissipation is concentrated and operating temperature increases
Solution Approach 1:
The total power requirement is segmented and distributed across multiple independent array elements and sub-arrays. Instead of concentrating high power in fewer elements, the system uses more elements at lower individual power levels, which disperses heat generation and reduces peak operating temperatures while maintaining total system capacity.
Solution Approach 2:
The patent introduces intermediate power amplification stages and impedance matching networks between the signal source and array elements. These intermediary components optimize power distribution and reduce inefficiency-induced heat generation, allowing the system to achieve required capacity with lower overall power dissipation.
3Strength
If the number of array elements is increased to maintain gain, then the antenna gain is improved, but the heat dissipation concentration is reduced
Solution Approach 1:
The array is segmented into multiple sub-arrays with independent feeding networks, allowing heat dissipation to be distributed across multiple localized regions rather than concentrated in a single large array. This segmentation maintains total gain while improving thermal management efficiency.
Solution Approach 2:
By transitioning to a multi-layer three-dimensional configuration, the heat dissipation volume is increased without proportionally increasing the number of active radiating elements. The additional vertical dimension provides more space for thermal management while maintaining the effective aperture needed for high gain.
Data Source
AI summary
The present application provides an array antenna and a mobile terminal. This application increases the number of array elements through the arrangement of the plurality of rows of array elements, thereby reducing the maximum gain reduction of the array antenna in the maximum scan area, and by the arrangement, each feeding network supports the 28 GHz frequency band and the 39 GHz frequency band such that 2*2 MIMO signal differential communication is realized for each array element, thereby achieving support of dual-frequency and dual-polarization signals by the array antenna. Meanwhile, it can automatically adjust the antenna array form according to the strength of signals, thereby reducing the input power, improving the energy efficiency of the system and dynamically adjusting chip operating temperature.


