Dual Band Imaging Sensor Attachment for Mobile Devices
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Solution Overview
Problem
Portable electronic devices, such as smartphones and tablets, lack true infrared imaging capabilities, as their image sensors are limited to capturing visible light and only a limited range of near-infrared wavelengths, necessitating a solution to provide multi-spectrum imaging functionalities.
Innovation Solution
A device attachment with a housing that includes a multi-wavelength image sensor assembly capable of capturing infrared and visible light data, a processing module for data transmission, and a thermal infrared imaging module maintained in alignment with a non-thermal imaging module using a bridge, along with a shutter for controlling external infrared energy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-wavelength image sensor assembly is added to portable devices, then infrared imaging capability is improved, but device complexity increases
Solution Approach 1:
The imaging system is divided into separate thermal infrared imaging module and non-thermal imaging module, each optimized for specific wavelength ranges. This segmentation allows independent optimization of each sensor while maintaining overall system functionality, resolving the contradiction by adding capability without proportionally increasing complexity.
Solution Approach 2:
A bridge structure is introduced as an intermediary component to mechanically couple the thermal and non-thermal imaging modules. This intermediary maintains precise relative positioning and alignment between modules while allowing independent mounting and removal, thus adding infrared capability without significantly complicating the overall device architecture.
2Measurement precision
If thermal infrared imaging module and non-thermal imaging module are precisely aligned, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The bridge structure is pre-configured with precise geometric relationships and mounting features that automatically establish correct alignment when modules are attached. This preliminary preparation of alignment features eliminates the need for complex real-time adjustment mechanisms, achieving high measurement precision without proportionally increasing device complexity.
Data Source
AI summary
Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. The device attachment may include an infrared imagining module and a non-thermal imaging module that cooperate with one or more of a non-thermal imaging module in an attached device and a light source in the attached device for capturing and processing images.