Dual Band Imaging Sensor Attachment for Mobile Devices
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Solution Overview
Problem
Portable electronic devices typically lack infrared imaging capabilities, as their image sensors are limited to capturing visible light, necessitating techniques to provide infrared imaging functionality in a compact and power-efficient form factor.
Innovation Solution
A device attachment with a multi-wavelength image sensor assembly and processing module that captures and processes both infrared and visible light image data, allowing for the combination of images to enhance imaging capabilities, such as distance measurement and temperature calibration, using a smartphone or other portable electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a multi-wavelength image sensor assembly is integrated into a device attachment, then infrared imaging functionality is enabled, but device complexity increases
Solution Approach 1:
The device attachment houses the multi-wavelength image sensor assembly, processing module, and other components within a compact nested structure that attaches to the portable electronic device. The attachment itself is nested within the device's form factor, creating a space-efficient integrated system that enables infrared imaging without requiring a completely new device design.
Solution Approach 2:
The multi-wavelength image sensor assembly is designed to capture multiple wavelengths (visible and infrared) simultaneously, enabling the same hardware component to perform multiple imaging functions. The processing module also handles both visible and infrared image data processing, reducing the need for separate dedicated components for each function.
2Adaptability or versatility
If a device attachment with multi-wavelength sensor assembly is used, then dual band imaging capability is achieved, but manufacturing complexity increases
Solution Approach 1:
The system is divided into separate modules: the device attachment with multi-wavelength sensor assembly is manufactured as a distinct unit that can be independently produced and then attached to the portable electronic device. This segmentation allows each module to be optimized and manufactured separately using appropriate processes, reducing overall manufacturing complexity despite the advanced capabilities.
3Loss of information
If infrared and visible light image data are combined, then enhanced scene analysis is achieved, but processing requirements increase
Solution Approach 1:
The processing module merges infrared and visible light image data streams into a unified processing pipeline, combining the information from both wavelength bands to enhance scene analysis capabilities. This integrated approach allows for more comprehensive object detection and thermal imaging while optimizing resource utilization compared to separate processing systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables infrared imaging functionality in portable devices, enhancing imaging applications like thermal imaging, object temperature measurement, and scene illumination, while maintaining a small form factor and low power consumption.
Implementation Method 1
a multi-wavelength image sensor assembly disposed within the housing and configured to capture infrared image data and visible light image data
Data Source
AI summary
Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. The device attachment may include an infrared imagining module and a non-thermal imaging module that cooperate with one or more of a non-thermal imaging module in an attached device and a light source in the attached device for capturing and processing images.