Dual-Base Wafer Positioning for Simultaneous Inspection
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Solution Overview
Problem
Current integrated circuit wafer positioning devices fail to provide precise and rapid positioning, especially when inspecting small patterns on the wafer surfaces, and do not allow simultaneous inspection of both faces of the wafer.
Innovation Solution
A device with two offset bases that allow vertical positioning of the wafer, equipped with sensors on each base for simultaneous inspection of both faces, enabling precise and rapid positioning and measurement of wafer thickness and patterns, using a combination of vertical and horizontal offset positioning and non-contact adhesion methods like vacuum air bearings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single base positioning system is used, then the device architecture is simple, but positioning precision and inspection speed are insufficient
Solution Approach 1:
The positioning device is segmented into two separate bases (first base and second base) positioned at different heights, with each base providing independent positioning reference. This segmentation enables precise vertical positioning of the wafer while maintaining manageable device architecture through modular design.
2Measurement precision
If the wafer is positioned close to sensors for precise inspection, then measurement precision improves, but positioning stability deteriorates
Solution Approach 1:
The invention introduces a vertical dimension to the positioning system by placing bases at different heights (first base at higher position, second base at lower position). This vertical arrangement provides stable support while allowing the wafer to be positioned close to sensors for precise inspection without compromising stability.
3Productivity
If rapid wafer movement is implemented for inspecting different areas, then inspection productivity increases, but positioning precision decreases
Solution Approach 1:
The positioning system incorporates dynamic capabilities allowing rapid movement of the wafer between different inspection areas while maintaining precision through the dual-base reference system. The wafer can be quickly repositioned along the vertical axis between the first and second bases for efficient multi-area inspection.
4Adaptability or versatility
If only one base is used for positioning, then device complexity is low, but simultaneous inspection of both wafer faces is not possible
Solution Approach 1:
By utilizing vertical dimension with bases positioned at different heights, the system enables simultaneous access to both upper and lower faces of the wafer. The first base (higher) and second base (lower) provide reference points that allow sensors to inspect both faces concurrently without mechanical interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise, rapid, and simultaneous inspection of both faces of the wafer, improving positioning accuracy and stability while minimizing energy consumption and avoiding contact friction.
Implementation Method 1
The device also comprises a vacuum air bearing for supporting the mobile support and the wafer non-contactually
Data Source
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AI summary
The present invention relates to a positioning device (100) for positioning an integrated circuit board (W), comprising: - a base (102), referred to as the upper base, and a base (106), referred to as the lower base, arranged at a separation from one another in a direction (Z), referred to as the vertical direction, in such a way as to leave a free space between said bases (102, 106); - a support (110), capable of moving between said upper (102) and lower (106) bases, and comprising a receiving location (112) for receiving said circuit board (W) to be inspected; - at least a first positioning means (118) for positioning said support (110) in the vertical direction (Z) against, or cooperating with, said upper base (102); and - at least one second positioning means (122) for positioning said support (110) in the vertical direction (Z) against, or cooperating with, said lower base (106). The invention also relates to an apparatus for inspecting an integrated circuit board utilising such a positioning device.