Dual Baseplate Cooling for Vehicle Computing Blades
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Solution Overview
Problem
Autonomous vehicle computing systems face challenges in maintaining optimal operating temperatures, leading to potential damage and reduced service life due to inadequate cooling solutions, which can impact safety and performance.
Innovation Solution
The implementation of a dual cooling baseplate system with parallel planar surfaces and integrated cooling channels, coupled with a cooling fluid connector, allows for efficient heat transfer from processor and coprocessor blades to a cooling fluid, using thermally conductive materials and flexible connectors for data and power transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling system is implemented for autonomous vehicle computing systems, then temperature control and component lifespan are improved, but device complexity increases
Solution Approach 1:
The patent combines multiple cooling baseplates into a single integrated cooling system that simultaneously cools both the processor blade and coprocessor blades. The cooling fluid flows through channels in both baseplates in series, merging the cooling functions into one unified system rather than using separate cooling systems for each component.
Solution Approach 2:
The cooling baseplates serve multiple functions: they provide thermal conduction from the processor and coprocessor blades to the cooling fluid, structurally support the computing components, and act as mounting surfaces for the processor and coprocessor blades. This multi-functionality reduces the need for additional separate cooling components.
2Use of energy by moving object
If surface-mounted processor and coprocessor blades are used on cooling baseplates, then heat transfer efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent creates direct thermal contact between the processor blade and the first cooling baseplate, and between the coprocessor blades and the second cooling baseplate. This localized thermal coupling ensures efficient heat transfer from the heat-generating components to the cooling fluid while allowing the mounting structure to accommodate reasonable manufacturing tolerances.
3Temperature
If a cooling fluid connector is used to couple multiple cooling baseplates, then cooling coverage is improved, but device complexity increases
Solution Approach 1:
The patent uses a cooling fluid connector that utilizes hydraulic principles to couple the first and second cooling baseplates. The cooling fluid flows through the connector from one baseplate to the other, creating a series-connected hydraulic circuit that extends cooling coverage to multiple components while using standard hydraulic connection techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages temperature within safe limits, extending component lifespan, enhancing performance, and ensuring reliable operation of autonomous vehicle systems.
Implementation Method 1
at least one cooling channel coupled between the inlet and the outlet. The at least one cooling channel can be positioned between the first planar cooling surface and the first external housing. The at least one cooling channel can be configured to allow the cooling fluid to flow between the inlet and the outlet and provide cooling to the first planar cooling surface
Data Source
AI summary
Systems and methods for cooling a vehicle computing system are provided. A computing system can include a first cooling baseplate including a first planar cooling surface and a second cooling baseplate including a second planar cooling surface. The computing system can further include one or more computing devices including a processor blade positioned on the first planar cooling surface, a coprocessor blade positioned on the second planar cooling surface, and a flexible connector coupled between the processor blade and the coprocessor blade. The flexible connector can be configured to transfer at least one of data or electric power between the processor blade and the coprocessor blade. The first planar cooling surface can be configured to transfer heat from the processor blade to a cooling fluid via conduction. The second planar cooling surface can be configured to transfer heat from the coprocessor blade to the cooling fluid via conduction.