Dual Baseplate Cooling for Autonomous Vehicle Computing Blades
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Solution Overview
Problem
Autonomous vehicle computing systems face challenges in maintaining optimal operating temperatures, as high temperatures can reduce the service life and performance of computing components, and existing cooling solutions may not efficiently manage heat in dynamic environments.
Innovation Solution
The implementation of a dual-planar cooling baseplate system with integrated cooling channels and a flexible connector for efficient heat transfer, utilizing thermally conductive materials and a cooling fluid circulation system to manage heat across processor and coprocessor blades.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cooling system is implemented for autonomous vehicle computing components, then the service life and performance of computing components are improved, but the device complexity increases
Solution Approach 1:
The patent combines the cooling system with the mounting structure by integrating cooling baseplates directly into the mounting apparatus. The cooling channels are embedded within the baseplates that also serve as mounting surfaces for processors and coprocessors, merging thermal management and mechanical support functions into a single integrated structure.
Solution Approach 2:
The cooling baseplates serve multiple functions simultaneously: they provide thermal conduction pathways for heat dissipation, act as mechanical mounting surfaces for computing components, and serve as structural support elements. This multi-functionality reduces the need for separate cooling components and simplifies the overall system architecture.
2Temperature
If existing cooling solutions are used, then cooling is provided, but they do not efficiently manage heat in dynamic environments
Solution Approach 1:
The cooling system is divided into separate cooling baseplates for different computing components (processors, coprocessors, memory devices), each with optimized thermal pathways tailored to the specific heat generation characteristics of each component type. This segmentation allows for targeted thermal management that adapts to the unique thermal profiles of different components in dynamic operating conditions.
Solution Approach 2:
The cooling baseplates feature locally optimized thermal conduction pathways with varying channel configurations, densities, and geometries matched to the specific heat generation patterns of different computing components. High-heat-generation areas receive enhanced cooling coverage while lower-heat areas use proportionally less cooling resources, optimizing overall thermal management efficiency.
3Temperature
If computing components are mounted on cooling baseplates, then heat transfer is improved, but the system design flexibility is reduced
Solution Approach 1:
The cooling baseplates are designed with modular configurations that can be adapted to different computing component arrangements. The thermal pathways and channel geometries can be customized based on the specific layout requirements of processors, coprocessors, and memory devices, allowing the system to maintain optimal heat transfer efficiency while accommodating various design configurations and upgrade scenarios.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains computing components within safe temperature ranges, enhancing reliability, performance, and service life while allowing for flexible system design and incremental upgrades.
Implementation Method 1
The first planar cooling surface can be configured to transfer heat from the processor blade to the cooling fluid via conduction. The second planar cooling surface can be configured to transfer heat from the one or more coprocessor blades to the cooling fluid via conduction.
Data Source
AI summary
Systems and methods for cooling a vehicle computing system are provided. A computing system can include a first cooling baseplate including a first planar cooling surface and a second cooling baseplate including a second planar cooling surface. The computing system can further include one or more computing devices including a processor blade positioned on the first planar cooling surface, a coprocessor blade positioned on the second planar cooling surface, and a flexible connector coupled between the processor blade and the coprocessor blade. The flexible connector can be configured to transfer at least one of data or electric power between the processor blade and the coprocessor blade. The first planar cooling surface can be configured to transfer heat from the processor blade to a cooling fluid via conduction. The second planar cooling surface can be configured to transfer heat from the coprocessor blade to the cooling fluid via conduction.