Dual Beam Laser Transfer for High-Resolution Patterning
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Solution Overview
Problem
Existing direct write laser techniques face limitations in resolution and printing capabilities due to the viscoelastic properties of materials, particularly in microelectronics and bioelectronics applications, where methods like Laser Induced Forward Transfer (LIFT) require further processing and are limited by the need for precise control and high-resolution patterning.
Innovation Solution
A dual beam laser transfer method is employed, utilizing a first laser to propel polymer or monomer materials from a donor substrate to a receiver substrate, followed by a second laser for post-processing, such as photo-polymerization, to achieve high-resolution patterns and functionalization of materials like DNA, aptamers, and proteins on various substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If Laser Induced Forward Transfer (LIFT) is used to transfer materials, then material transfer capability is improved, but resolution and printing precision deteriorate due to viscoelastic properties of materials
Solution Approach 1:
The laser source is divided into two separate beams: a first laser beam for material transfer and a second laser beam for post-processing. This segmentation allows each beam to be optimized for its specific function, with the first beam achieving high-energy transfer and the second beam providing precise resolution control during post-processing, thereby resolving the contradiction between transfer capability and printing precision
Solution Approach 2:
The first laser beam performs preliminary material transfer action before the second laser beam performs the final precision processing. By transferring material first and then applying post-processing, the system achieves both high transfer capability and high resolution in sequence, resolving the contradiction between these two requirements
2Manufacturing precision
If direct write laser techniques are used, then micron and sub-micron resolution is improved, but printing capabilities and material deposition efficiency deteriorate
Solution Approach 1:
The invention merges two laser-based processes into a single integrated system: material transfer via LIFT and post-processing via laser irradiation. This combination allows the system to achieve both high-resolution patterning and enhanced printing capabilities, as the first laser beam deposits material efficiently while the second laser beam refines the pattern with micron and sub-micron precision, thereby resolving the contradiction between resolution and productivity
3Productivity
If high energy laser beams are used for material transfer, then transfer efficiency is improved, but control precision and pattern accuracy deteriorate
Solution Approach 1:
The high-energy laser source is segmented into two functional beams: the first laser beam delivers high energy for efficient material transfer, while the second laser beam provides low-energy precise control for pattern accuracy. This segmentation resolves the contradiction by assigning different energy levels to different functional requirements within the same system
Solution Approach 2:
The first laser beam acts as an intermediary that transfers material from the donor substrate to the receiver substrate, enabling the second laser beam to then perform precise patterning on the transferred material. This intermediary transfer step allows the system to achieve both high transfer efficiency and high pattern accuracy without requiring a single laser beam to simultaneously satisfy both contradictory requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables high-resolution patterning and functionalization of biological and non-biological materials with precise control, allowing for efficient transfer and post-processing of materials like DNA, aptamers, and proteins, enhancing applications in microelectronics and bioelectronics.
Implementation Method 1
irradiating with a first laser beam of a laser a portion of a back side of the transparent portion to increase the pressure and/or temperature of the absorbing layer to eject a portion of the polymer or monomer material from the donor substrate and transfer the portion of the material to the receiver surface
Implementation Method 2
postprocessing the portion of the polymer or monomer material transferred on the receiver substrate by irradiating with a second laser beam of a laser a portion of the front side of the receiver surface, wherein post-processing comprises photo-polymerization of the transferred polymer or monomer material
Data Source
Figure 1(a)~1(b)
Figure 2
AI summary
Methods and devices for transferring biological or non-biological material coated on a front surface of a donor substrate to a front surface of a receiver substrate are disclosed. In example implementations, the front surface of the donor substrate is facing the front surface of the receiver substrate. The donor surface comprises a transparent portion and an absorbing layer on a front side of the transparent portion. A first laser beam of a laser irradiates a portion of a back side of the transparent portion to increase the pressure and/or temperature of the absorbing layer to eject a portion of the biological or non-biological material from the donor substrate and transfer the portion of the biological or non-biological material to the receiver surface. The portion of the biological or non-biological material transferred on the second substrate is post-processed by irradiating with a second laser beam of a laser a portion of the front side of the receiver surface.